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A kind of solder joint alloying forming method

An alloying and soldering technology, applied in welding equipment, welding medium, metal processing equipment, etc., can solve the problems of reducing the reliability of solder joints, and the thermal fatigue life of brazing joints affects tensile strength and fracture toughness, etc. Excellent drop resistance, uniform and fine structure, and simple process

Active Publication Date: 2021-09-24
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And as the number of reflows increases, the growth of the intermetallic compound formed by the solder joint will become faster and faster, and the thickness of the interfacial compound will gradually increase. Unreasonable growth will reduce the thermal fatigue life of the brazed joint and affect the tensile strength. and fracture toughness, ultimately reducing the reliability of solder joints, in view of this, the present invention intends to improve the formation of solder joint alloys

Method used

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  • A kind of solder joint alloying forming method
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  • A kind of solder joint alloying forming method

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Embodiment 1

[0032] A kind of solder joint alloying forming method

[0033] (1) Pre-grind pure metal tin powder, stir it evenly, and pour it into the tableting mold;

[0034] (2) Place the mold containing the powder on a constant temperature heating table and keep it at 100°C for 20 minutes;

[0035] (3) Quickly use a tablet press to press into pieces and peel them off to obtain the original pure tin sheet;

[0036] (4) heat-treat the pressed sheet for 2 h;

[0037] (5) Reflow soldering the solder piece at 265°C for 2 minutes to obtain the following Figure 5 The structure of the solder joint shown is a Sn-Cu alloy, showing Cu distributed on the tin matrix 6 sn 5 compound particles.

[0038] The pure metal tin forming the solder joints can be tin-based solders such as Sn-Bi and Sn-In in tin-based solders that do not contain pad metal.

[0039] The solder joint forming method used in this embodiment is as follows: figure 2 As shown, the solder joint formation process and the solder ...

Embodiment 2

[0042] In order to continuously optimize the Sn-Cu solder joint interface on the basis of changing the alloying method of the Sn-Cu solder joint; this embodiment adopts the method of graphene-doped pure tin solder joint to improve the interface stability and anti-drop performance of the solder joint .

[0043] This embodiment discloses a method for forming alloyed solder joints using a metal composite sheet doped with 0.1% graphene. The specific steps are:

[0044] (1) Pre-grind, stir and mix the graphene with a mass fraction of 0.1% and the metal tin powder with a mass fraction of 99.9%, and pour it into a tableting mold;

[0045] (2) Place the mold containing the mixed powder on a constant temperature heating table and keep it at 100°C for 20 minutes;

[0046] (3) Quickly use a tablet press to press into a sheet, and peel it off to obtain a tin-graphene composite sheet;

[0047] (4) Heat-treat the pressed composite sheets with different contents at 180°C for 2 h;

[0048]...

Embodiment 3

[0050] This embodiment discloses a method for forming alloyed solder joints using a metal composite sheet doped with 0.3% graphene. The specific steps are:

[0051] (1) Pre-grind, stir and mix the graphene with a mass fraction of 0.3% and the metal tin powder with a mass fraction of 99.7%, and pour it into a tableting mold;

[0052] (2) Place the mold containing the mixed powder on a constant temperature heating table and keep it at 100°C for 20 minutes;

[0053] (3) Quickly use a tablet press to press into a sheet, and peel it off to obtain a tin-graphene composite sheet;

[0054] (4) Heat-treat the pressed composite sheets with different contents for 2 h;

[0055] (5) Reflow soldering the solder piece at 265°C for 2 minutes to obtain the following Figure 7The solder joint structure shown. For its compound thickness and drop performance see Figure 9 , Figure 10 .

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Abstract

The invention discloses a method for forming solder joint alloying. In this method, the pad material is used as the metal source for the alloying of the solder joint alloy, and the alloying treatment is formed during the reflow process, and the alloying of the solder alloy and the reflow process during the formation of the solder joint are combined into one, which simplifies the process. Process. After forming solder joints with copper, the solder joints formed by the alloying method are doped with graphene, so that the thickness of the intermetallic interface compound formed at the brazed joint is smaller, which can improve the reliability of the solder joints, and the joints formed by welding The interface is stable, the structure is uniform and fine, and the drop resistance is excellent.

Description

technical field [0001] The invention relates to the fields of composite materials and electronic interconnection materials, in particular to a method for alloying and forming solder joints. Background technique [0002] Graphene (Graphene) is a new type of carbonaceous material discovered by scientists Geim, Novoselov and others in 2004. It forms a two-dimensional honeycomb lattice structure through the close packing of a single layer of carbon atoms, and its structure is very stable. It is both the thinnest material (approximately 0.34 nm thick) and the hardest. The thermal conductivity is as high as 5150 W / (m•K), which is three times that of pure diamond at room temperature. Its carrier mobility reaches 15000 cm 2 / (v•s), is the material with the smallest resistivity found so far. Because of its unique physical, chemical and mechanical properties, it provides the driving force for the development of composite materials. [0003] The general graphene-metal composite sh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K35/14B23K35/26
CPCB23K1/0008B23K35/0233B23K35/262
Inventor 陶杭丁俊文高幸郑迪刘宁王小京
Owner JIANGSU UNIV OF SCI & TECH