Moisture-curable hot-melt adhesive agent

A hot-melt adhesive and moisture-curing technology, which is applied in the direction of adhesive types, rosin adhesives, polyurea/polyurethane adhesives, etc., can solve the difficult problem of preparing moisture-curing hot-melt adhesives, etc. problems, achieve excellent initial bond strength, bond strength improvement, and efficient preparation

Inactive Publication Date: 2020-01-10
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, it is difficult to prepare a moisture-curing hot melt adhesive with an excellent balance of various properties

Method used

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  • Moisture-curable hot-melt adhesive agent
  • Moisture-curable hot-melt adhesive agent
  • Moisture-curable hot-melt adhesive agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0173] Components (A) to (E) were mixed to prepare a moisture-curable hot melt adhesive.

[0174] Specifically, components (B4), (B5), (C3), (C4), (C5), (D1) and (E1 ) are melt mixed to prepare a molten composition.

[0175] Then, the polyester polyol (A2) and the above melting composition were mixed in the compositions shown in Table 2 (parts by weight). Place the mixture in a reaction vessel. After heating the mixture at a temperature of 130°C, the mixture was stirred at the same temperature for one hour under reduced pressure. After confirming that moisture is removed and kneading the mixture sufficiently, 4,4'-diphenylmethane diisocyanate (A4) is added thereto, and the mixture is stirred at the same temperature under reduced pressure for one hour to obtain a moisture-curable thermal Melt adhesive.

Embodiment 2-6

[0176]

[0177] Of the compositions shown in Table 2 and Table 4, components (A) to (E) were prepared in the same manner as in Example 1 to prepare a moisture-curable hot melt adhesive.

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Abstract

To provide a moisture-curable hot-melt adhesive agent having excellent balance of initial adhesive strength, adhesive strength after curing and heat resistance and the like, and a layered product bonded with the moisture-curable hot-melt adhesive agent. Means for solving the problem: A moisture-curable hot-melt adhesive agent comprising an urethane prepolymer having an isocyanate group at the end(A), a styrene-isoprene based block copolymer (B), and a tackifying resin (C), wherein the moisture-curable hot-melt adhesive agent comprises 25 to 64% by weight of (A), based on 100 parts by weight in total of (A) and (B).

Description

[0001] Cross References to Related Applications [0002] Pursuant to Article 4 of the Paris Convention, this application claims the benefit of Japanese Patent Application No. 2017-106258 filed in Japan on May 30, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a moisture-curing hot-melt adhesive. Background technique [0004] Hot-melt adhesives are used in various fields such as building interior materials (or construction material field) and electronic material field. Moisture-curing hot-melt adhesives have attracted attention from the viewpoint of being less susceptible to external factors and being easy to use for a long time. [0005] Examples of the moisture-curable hot-melt adhesive include an adhesive containing a urethane prepolymer having an isocyanate group at a terminal. Coating at least one of the substrate and the adherend (adherend) with a moisture-curable hot-melt adhesive generally i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/48C08G18/76C08G18/10C08G18/12C08G18/40C08G18/42C09J175/06C09J193/04
CPCC08G18/4825C08G18/7671C08G18/10C08G18/12C08G18/4018C08G18/4202C08G18/4238C09J175/06C09J193/04C08G2170/20C08L2205/025C08G18/307C08L53/02C08L93/04C08L75/04C08G18/69C08G18/6204C09J7/30C08G18/3855C08G18/7621C08K5/0016C08K5/01C09J153/02C09J175/04
Inventor 松田健二高森爱早川正
Owner HENKEL KGAA
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