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hot melt adhesive composition

A composition and adhesive technology, applied in the direction of adhesives, etc., can solve the problems of hot-melt adhesive preparation in synthetic waxes, and achieve the effects of fast curing time and good fiber tearing and bonding properties

Active Publication Date: 2021-11-05
HB FULLER CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Synthetic waxes also tend to present hot melt adhesive formulation issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0080] test program

[0081] Test procedures used in the examples include the following procedures. All ratios and percentages are by weight unless otherwise indicated. Unless otherwise indicated, procedures were performed at room temperature (ie, ambient temperature from about 20°C to about 25°C) and ambient humidity (ie, 30% to 70%).

[0082] Viscosity Test Method

[0083] According to ASTM D-3236 entitled "Standard Test Method for Apparent Viscosity of Hot Melt Adhesives and Coating Materials" (October 31, 1988) Viscosity was determined with a Brookfield Viscometer, Brookfield Thermosel heated sample chamber and spindle #27. Results are reported in centipoise (cP).

[0084] Curing Time Test Method

[0085] A bead of adhesive composition measuring 5.08 cm by 0.24 cm was applied to a first substrate of WESTROCK 44 lb ECT 100% recycled content containerboard using a MEC ASM-15N hot melt bonding simulator. The temperature at which the adhesive composition is applied t...

Embodiment E1-E7

[0100] Embodiment E1-E7 and comparison C1 and C2

[0101] Examples E1-E7 and controls C1 and C2 were prepared by mixing the components in the amounts specified in Table 1 (weight %) and heating the mixture at 175°C to 190°C with stirring. Examples E1-E7 and Controls C1 and C2 were then tested according to the Viscosity, Cure Time, % Fiber Tear and PAFT test methods except that the viscosity was measured at 177°C, 149°C or 135°C as indicated in the table , and the cure time and % fiber tear were measured at an application temperature of 177°C or 149°C as indicated in the table. Additionally determine clarity and homogeneity. The results are reported in Table 1.

[0102]

[0103]

[0104] 1 = AFFINITY GA-1950 ethylene-octene interpolymer (DowDuPont Chemicals Company, Midland, Michigan, USA)

[0105] 2 = AFFINITY GA-1900 ethylene-octene interpolymer (DowDuPont Chemicals Company, Midland, Michigan, USA)

[0106] 3 = ATEVA 1880A ethylene-vinyl acetate copolymer with 6.7...

Embodiment E8-E16 and C3

[0125] Examples E8-E16 and C3 were prepared by mixing the components in the amounts (weight %) specified in Table 2 and heating the mixture at 175°C to 190°C with stirring. Examples E8-E16 and C3 were then tested according to Viscosity, Cure Time, % Fiber Tear, and PAFT test methods, except that the viscosity was measured at 177°C, 149°C, or 135°C as indicated in the table, and the cure Time and % fiber tear were measured at an application temperature of 177°C or 149°C as indicated in the table. Additionally determine clarity and homogeneity. The results are reported in Table 2.

[0126]

[0127]

[0128] 20 = AFFINITY GA-1000R maleic anhydride modified ethylene-octene copolymer (DowDuPont Chemicals Company, Midland, Michigan, USA)

[0129] 21 = TRECORA CWP-400 polyethylene wax (Trecora Chemical, Pasadena, Texas, USA (Trecora Chemical, Pasadena, Texas))

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Abstract

The present invention relates to a hot melt adhesive composition comprising a first ethylene-alpha-olefin copolymer having a density of not more than 0.90 grams per cubic centimeter; a second styrene block copolymer a tackifier; a synthetic wax having a melting point of at least 70° C. and a heat of fusion of at least 200 joules / gram; Monomeric ethylene-polar comonomer copolymer, propylene-alpha derived from at least 8 mole % comonomer exhibiting a heat of fusion of at least 5 J / g to no more than 60 J / g and having a polydispersity index of no more than 10 - Olefin copolymers, and propylene homopolymers exhibiting a heat of fusion of at least 5 J / g to no more than 60 J / g.

Description

Background technique [0001] The present invention relates to formulating hot melt adhesive compositions that exhibit strong bonds, fast cure times, and good low temperature bonding characteristics. [0002] Hot melt adhesive compositions are typically used to bond two substrates together and are applied to the substrates in a molten state. To be commercially viable, most hot melt adhesive compositions must maintain adhesion to the substrate at room temperature, and to be suitable for high-speed packaging operations, the adhesive must also exhibit fast cure times and fiber tear bonding. For many applications, it is also desirable for the adhesive to exhibit fiber tear bonding at low temperatures. [0003] Many different types of polymers are used in various hot melt adhesive compositions. However, it is often difficult to combine different types of polymers in the same composition because polymers tend to be incompatible with each other, phase separate on heating, phase sepa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/08C09J123/12C09J123/14C08L23/08C08L53/00
CPCC09J123/0815C09J123/0853C09J123/12C09J123/14C08L2205/03C08L2205/035C08L23/0853C08L53/025C08L23/14C08L23/0869C08L23/0815C08L51/06C08L23/12C09J165/00
Inventor B·艾池勒-约翰逊T·F·考夫曼J·E·威尔顿A·R·米歇尔
Owner HB FULLER CO