Hanging device for electroplating printed circuit board

A technology for printed circuit boards and bottom plates, which is applied in the electrolysis process and electrolysis components, etc., can solve the problems that the clamping mechanism cannot be operated in a unified manner, the alarm mechanism is easily damaged, and the clamping force cannot be adjusted, so as to achieve safe use and easy adjustment. , the production effect is fast

Inactive Publication Date: 2020-01-17
陕西安易信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a hanging device for electroplating of printed circuit boards, which has the ability to adjust the clamping force, and can simultaneously operate the opening and closing of multiple sets of clamping mechanisms, and the alarm mechanism is more convenient to use. Safety and other advantages solve the problem that the alarm mechanism used in the traditional hanging device for circuit board electroplating is easily damaged, the clamping mechanism cannot be opened and cooperated uniformly, and the clamping force cannot be adjusted

Method used

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  • Hanging device for electroplating printed circuit board
  • Hanging device for electroplating printed circuit board
  • Hanging device for electroplating printed circuit board

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1-5 , a hanging device for printed circuit board electroplating, including a mounting plate 1, the front side of the mounting plate 1 is evenly fixed and installed with three sets of clamping mechanisms 2 near the lower side, and the rear side of the clamping mechanism 2 is close to the upper side The side is fixedly connected with a guide mechanism 3, and the guide mechanism 3 is inserted into the rear side of the mounting plate 1, the rear...

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Abstract

The invention discloses a hanging device for electroplating a printed circuit board, and relates to the technical field of circuit boards. The hanging device comprises a mounting plate, wherein threesets of clamping mechanisms are uniformly and fixedly mounted on the portion, close to the lower side, of the front side face of the mounting plate, and a guide mechanism is fixedly connected to the position, close to the upper side, of the rear side faces of the clamping mechanisms; the guide mechanism is inserted into the rear side face of the mounting plate, and the rear side face of the guidemechanism is fixedly connected with a movable plate; and an adjusting mechanism capable of adjusting the tightness of the clamping mechanisms is fixedly connected to the position, close to the top, ofthe front side face of the movable plate, and the portions, close to the left side and the right side, of the rear side face of the mounting plate are each provided with an alarm mechanism. The clamping force of the clamping plate can be strengthened through the guiding mechanism, so that clamping is firmer, and the clamping force is conveniently adjusted through the cooperation of the adjustingmechanism; meanwhile, the opening and closing of the multiple sets of clamping mechanisms can be synchronously operated, and then the alarm mechanism is installed on the mounting plate, so that the alarm mechanism is safer to use, and the use is safer.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a hanging device for electroplating printed circuit boards. Background technique [0002] During the electroplating process of the circuit board, it is necessary to fix and hang the circuit board with a hanger, and connect the hanger to the electrode plate to conduct current, and immerse the hanger with the circuit board in the electroplating solution to make the electroplating The liquid is evenly distributed on the circuit board to complete the electroplating process. During the processing and manufacturing of the circuit board, the circuit board often needs to be electroplated. However, the existing hanging device for circuit board electroplating still has the following problems during use : [0003] 1. In the existing technology, the traditional hanging device for circuit board electroplating usually installs the electric eye detection mechanism on the fixture and soa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/08C25D7/00
CPCC25D7/00C25D17/08
Inventor 白友斌
Owner 陕西安易信息科技有限公司
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