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A modular and enveloping graphite radiator and its forming method

A molding method and radiator technology, which are applied in the direction of modification, cooling/ventilation/heating transformation through conduction heat transfer, etc., can solve the problems of system instability, damage, poor heat dissipation, etc., to improve the convective heat transfer coefficient, increase the The effect of convection space and good heat exchange effect

Active Publication Date: 2020-06-16
常州市金坛碳谷新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the demand for electronic devices in life is increasing day by day, but electronic devices or equipment will generate a lot of heat when they are working. If the heat dissipation is not good, it will generate higher temperature, which will affect the normal operation of components and cause system unstable or even damaged, so the requirements for its heat dissipation are higher
[0003] At present, most of the heat sinks used in electronic devices are finned heat sinks, which are made of aluminum or copper and their alloys. Improve the shape of the product or make a simple hollow structure, but limited to copper, aluminum and their alloys themselves, the heat dissipation capacity is insufficient, and the thermal conductivity of pure copper is 398W / m. K, the thermal conductivity of pure aluminum is 273 W / m. K, so the cooling effect is not very good

Method used

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  • A modular and enveloping graphite radiator and its forming method
  • A modular and enveloping graphite radiator and its forming method
  • A modular and enveloping graphite radiator and its forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] First, if Figure 1 to Figure 3 As shown, this embodiment provides a modular, enveloping graphite heat sink, including: a first heat dissipation substrate 1, a second heat dissipation substrate 2, a third heat dissipation substrate 3, eight first heat dissipation connecting pieces 4 and eight first heat dissipation connecting pieces 4 Two heat dissipation connecting pieces 5;

[0035] The first heat dissipation substrate 1, the second heat dissipation substrate 2 and the third heat dissipation substrate 3 are arranged sequentially from bottom to top, the vertical distance between the first heat dissipation substrate 1 and the second heat dissipation substrate 2 is 30mm, and the third The vertical distance between the heat dissipation substrate 3 and the second heat dissipation substrate 2 is 25 mm.

[0036] The circle centers of the first heat dissipation substrate 1, the second heat dissipation substrate 2 and the third heat dissipation substrate 3 are located on the ...

Embodiment 2

[0051] The difference between embodiment 2 and embodiment 1 is that there are 9 first heat dissipation connecting fins and 9 second heat dissipation connecting fins, distributed at equal intervals, and the third heat dissipation substrate is equally divided into 18 parts. Other structures and steps are the same as in Example 1.

Embodiment 3

[0053] The difference between embodiment 3 and embodiment 1 is that there are 7 first heat dissipation connecting fins and 7 second heat dissipation connecting fins, distributed at equal intervals, and the third heat dissipation substrate is equally divided into 14 parts. Other structures and steps are the same as in Example 1.

[0054] In order to study the influence of the number of the first heat dissipation connecting piece and the second heat dissipation connecting piece on the heat dissipation effect, the following test is carried out: take the LED wick as the heat source, the ambient temperature is 20°C, the power of the LED chip is 100W, and the LED wick is respectively The graphite radiators prepared in Examples 1 to 3 were installed for testing (to ensure that other parameters are the same), and the results are shown in Table 2.

[0055] Table 2

[0056] Example 1 Example 2 Example 3 Junction temperature (°C) 53 56 57

[0057] According ...

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Abstract

The invention discloses a modularized surrounding type graphite radiator and a forming method thereof, and belongs to the technical field of heat dissipation of electronic devices. The radiator comprises a first heat dissipation substrate, a second heat dissipation substrate and a third heat dissipation substrate which are sequentially arranged from bottom to top, and the circle centers of the first heat dissipation substrate, the second heat dissipation substrate and the third heat dissipation substrate are located on the same straight line. The tail ends of first heat dissipation connectingpieces are fixed to the upper surface of the first heat dissipation substrate and extend in a radial mode with the circle center of the first heat dissipation substrate as the center, so that the headends of the first heat dissipation connecting pieces are fixed between the second heat dissipation substrate and the third heat dissipation substrate. The first heat dissipation base plate, the second heat dissipation base plate, the third heat dissipation base plate, the first heat dissipation connecting pieces and the second heat dissipation connecting pieces form a the radiator with the modularized surrounding type structure, so the convection space is increased, the convective heat transfer coefficient is increased, and a better heat exchange effect can be obtained.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and in particular relates to a modular and enveloping graphite radiator and a forming method thereof. Background technique [0002] At present, the demand for electronic devices in life is increasing day by day, but electronic devices or equipment will generate a lot of heat when they are working. If the heat dissipation is not good, it will generate higher temperature, which will affect the normal operation of components and cause system unstable or even damaged, so the requirements for its heat dissipation are higher. [0003] At present, most of the heat sinks used in electronic devices are finned heat sinks, which are made of aluminum or copper and their alloys. Improve the shape of the product or make a simple hollow structure, but limited to copper, aluminum and their alloys themselves, the heat dissipation capacity is insufficient, and the thermal conductivi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 刘宝兵顾德新
Owner 常州市金坛碳谷新材料科技有限公司