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Current transmission and distribution mechanism and electronic equipment

A current, transmission and distribution technology, applied in the direction of circuits, electrical components, coupling devices, etc., can solve the problems of PCB board signal transmission influence, affect heat dissipation, etc., to achieve the effect of facilitating heat dissipation and solving limitations

Active Publication Date: 2020-01-21
HANGZHOU HIKVISION DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For the backplane with limited flow capacity, in the case of high current, it not only affects its heat dissipation, but also sets up multiple connectors, and also affects the signal transmission on the PCB board.

Method used

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  • Current transmission and distribution mechanism and electronic equipment
  • Current transmission and distribution mechanism and electronic equipment
  • Current transmission and distribution mechanism and electronic equipment

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Embodiment Construction

[0050] In order to make the technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0051] On the one hand, an embodiment of the present invention provides a current transmission and distribution mechanism for transmitting and distributing current on a printed circuit board, wherein, as attached figure 1 As shown, the printed circuit board includes: a backplane M, and a single board N inserted on the backplane M. The current transmission and distribution mechanism includes: a busbar assembly 1 for electrical contact with the backplane M; arranged on the busbar assembly 1, and insulating the positive electrode conductive block 2 and the negative electrode conductive block 3 from each other; arranged on the single board N, and a positive connector 4 and a negative connector 5 that are insulated from each other. Wherein, the positive co...

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PUM

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Abstract

The invention discloses a current transmission and distribution mechanism and electronic equipment, and relates to the power supply technology field. The current transmission and distribution mechanism is used for transmitting and distributing a current on a printed circuit board. The printed circuit board comprises a back plate and a single plate inserted into the back plate. The current transmission and distribution mechanism comprises a busbar component used for being electrically contacted with the back plate, a positive electrode conductive block, a negative electrode conductive block, apositive electrode connector and a negative electrode connector, wherein the positive electrode conductive block and the negative electrode conductive block are arranged on the busbar component and are insulated from each other; the positive electrode connector and the negative electrode connector are arranged on the single board and are insulated from each other; the positive conductive block iselectrically connected with the positive connector; and the negative conductive block is electrically connected with the negative connector. For the back plate with a limited through-current capability, by adopting the busbar component, a connector suitable for a large current is prevented from being arranged on the busbar component, heat dissipation and signal transmission of the printed circuitboard are not influenced, and limitation of the printed circuit board on large current transmission and distribution is solved.

Description

technical field [0001] The invention relates to the technical field of power supply, in particular to a current transmission and distribution mechanism and electronic equipment. Background technique [0002] For electronic equipment, such as network communication equipment, it will involve the transmission or distribution of relatively large current on the printed circuit board (Printed CircuitBoard, PCB). Therefore, it is necessary to provide a current transmission and distribution mechanism for realizing large current transmission or distribution. very necessary. [0003] In the prior art, the flow guide mechanism includes: a plurality of first connectors and a plurality of second connectors arranged on the backplane of the PCB board, and a plurality of third connectors arranged on the single board of the PCB board . Wherein, the multiple first connectors are respectively electrically connected to the multi-point power supply, and the multiple second connectors are respe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/71
CPCH01R12/712H01R12/716
Inventor 喻菊春祝轶伟
Owner HANGZHOU HIKVISION DIGITAL TECH
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