Etching protection process of single-sided hollowed-out plate
An etching protection, hollow plate technology, applied in the application of non-metallic protective layers, secondary processing of printed circuits, electrical components, etc., can solve problems such as unfavorable production of fine lines, and achieve the effect of avoiding the formation of pressure film air chambers
Inactive Publication Date: 2020-01-21
深圳市华旭达精密电路科技有限公司
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Problems solved by technology
The conventional method is to reduce the thickness of the cover film to reduce the step difference at the edge of the window opening of the cover film, or increase the thickness of the dry film to improve the filling capacity of the dry film, or design a good film lamination direction to avoid discharge when pressing the film. Gas, to ease the formation of pressure film air chamber, but the use of such an improvement scheme is not conducive to the production of fine lines, especially the production of hollow boards with thick copper and thick steps, such as using 1oz copper foil for line widths below 0.1mm production of products
Method used
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Embodiment 1
[0033] Example one, reference figure 1 , Cutting, through the cutting machine, the cover film 3 and pure copper foil 2 are cut to the size required by the engineering design, the cover film 3 is drilled and punched, and the hollow area on the cover film 3 is punched out to open the window. The die-cut cover film 3 and the pure copper foil 2 are aligned to form a hollow board base material. The screen printing machine is used for screen printing. First, a graphic screen is used to print only the liquid photosensitive and anti-etching ink layer 4 in the window area of the cover film 3, and then the cover film 3 is printed on the entire surface with a white screen. The existence of the window area makes it different from normal printing. The window area of the cover film 3 causes a step difference. It is necessary to select a screen mesh with a larger amount of oil, such as a 27-43T screen, and select the printing speed. 3 to 5 grids, 60 to 75 degrees of squeegee angle, one or...
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The invention discloses an etching protection process of a single-sided hollowed-out plate. The etching protection process comprises the following steps: 1, preparing a hollowed-out plate base material; 2, printing a liquid photosensitive anti-etching ink layer on the surface of the cover film of the hollow plate substrate, and baking and curing the liquid photosensitive anti-etching ink layer; 3,laminating a dry film; 4, performing aligning and exposing; 5, performing developing; 6, performing etching; 7, performing demolding. According to the invention, the problem of poor etching of the copper foil circuit of the windowing cover film at the windowing position is solved.
Description
Technical field [0001] The invention relates to the field of flexible circuit board preparation, in particular to an etching protection process for hollow boards. Background technique [0002] In the process of preparing flexible circuit boards, it is often necessary to use a single-sided hollow-out board design to prepare flexible circuit boards. However, the conventional double-sided dry film pressing process often forms a pressurized air chamber at the edge of the cover film opening in the hollow position . The conventional method is to reduce the thickness of the cover film to reduce the step difference at the edge of the window opening of the cover film, or to increase the thickness of the dry film to improve the filling capacity of the dry film, or to design a good lamination direction to discharge when the film is pressed. Air, alleviate the formation of compressed film air chambers, but the use of such an improvement scheme is not conducive to the production of fine line...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 文永兴文继昌杨书军
Owner 深圳市华旭达精密电路科技有限公司