Large-size silicon wafer packaging device and application method thereof

Abstract

The invention provides a large-size silicon wafer packaging device and an application method thereof. A lower shell and an upper shell are included and arranged in a separable manner. The lower shellis provided with a lower cavity with an upward opening. The upper shell is provided with an upper cavity with a downward opening. The lower cavity and the upper cavity are arranged in an alignment manner, and the height of the lower cavity is larger than that of the upper cavity. The lower cavity is internally provided with a plurality of isolation baffles, the isolation baffles are arranged in parallel and arranged in the width direction of the lower shell, the isolation baffles evenly divide the lower cavity into a plurality of storage grooves for containing silicon wafers, and gaps are formed between the lower end faces of the isolation baffles and the bottom face of the lower cavity. The provided packaging device solves the technical problems that in the prior art, silicon wafer packaging materials and the packaging manner are too simple and are not suitable for large-size silicon wafer packaging, and taking and placing are not easy, collapse breakage and wafer breaking in the transportation process are prevented, safety is high, and universality is high.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer packaging, and in particular relates to a packaging device for large-size silicon wafers and a method for using the same. Background technique [0002] The existing silicon wafer packaging is all small-sized carton packaging, and the silicon wafers are stacked in the carton. However, due to the large size of the packaging of the super-large silicon wafers currently produced, the existing packaging materials and packaging methods are too simple, difficult to take and place, easy to cause collapse and fragments during transportation, low safety and poor applicability Due to technical problems, it cannot meet the needs of mass production. Contents of the invention [0003] The invention provides a packaging device for large-size silicon wafers and its use method, especially the packaging of silicon wafers placed vertically with a side length of 180-220mm and a thickness of 150-200μm, w...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a packaging device for large-size silicon wafers and its use method, especially the packaging of silicon wafers placed vertically with a side length of 180-220mm and a thickness of 150-200μm, which solves the problem of packaging materials for silicon wafers in the prior art. And the packaging method is too simple, not suitable for the packaging of large-size silicon wafers and the technical problems that are difficult to take and place, to prevent collapse and fragments during transportation, high safety and strong applicability

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