Metal packaging shell with heat dissipation function

Abstract

The invention provides a metal packaging shell with avheat dissipation function, and belongs to the technical field of thevmetal packaging shell. The metal packaging shell with the heat dissipation function comprises a first shell, a second shell, a first clamping groove, a second clamping groove, a fixing piece, a first heat dissipation rib and a second heat dissipation rib. One end of the fixingpiece is connected with the first clamping groove, and the other end is connected with the second clamping groove and the fixing piece is respectively connected with the first shell and the second shell so that the first shell and the second shell can be conveniently installed. The heat in the shell is conducted through a first graphene film and a second graphene film and then conducted to a first heat dissipation column and a second heat dissipation column and then dissipated to the outside through the first heat dissipation rib and the second heat dissipation rib so that the heat dissipation efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of metal package shells, and relates to a metal package shell with heat dissipation function. Background technique [0002] At present, with the increasing power density of hybrid integrated circuits, the heat of the entire packaged metal components will increase rapidly. If the heat cannot be dissipated in time, it will cause damage to the hybrid integrated circuits in the package. At present, packaged metal components only rely on The thermal conductivity of the package shell metal can dissipate heat, but with the increase of heat dissipation of components, it is difficult to meet the heat dissipation requirements, which will inevitably cause damage to the hybrid integrated circuit in the package shell during long-term work. Contents of the invention [0003] The present invention aims at the above-mentioned problems existing in the prior art, and provides a metal packaging shell with a heat dissipation ...

AI Technical Summary

Problems solved by technology

[0002] At present, with the increasing power density of hybrid integrated circuits, the heat of the entire packaged metal components will increase rapidly. If the heat cannot be dissipated in time, it will cause damage to the hybrid integrated circuits in the package. At present, packaged metal components only rely on The thermal conductivity of the package shell metal is used for heat dissipation, but with the increase of heat dissipation of components, it is difficult to meet the heat dissipation requirements, which will inevitably cause damage to the hybrid integrated circuit in the package shell during long-term work.

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