Projector
A technology for projectors and heat sinks, applied in the field of projectors, can solve the problems of low heat dissipation efficiency of heat sources and low efficiency of circuit boards, etc., and achieve the effect of increasing contact efficiency and increasing heat dissipation efficiency
Active Publication Date: 2020-02-04
SHENZHEN HUOLE TECH DEV CO LTD
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Problems solved by technology
However, the efficiency of the current hot plate to absorb the circuit board is not high, resulting in the heat dissipation efficiency of the heat source is not high
Method used
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0027] In the description of the embodiments of the present application, it should be understood that the orientation or positional relationship indicated by the term "thickness" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than implying Or an indication that the device or element referred to must have a particular orientation, be constructed and oper...
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The invention discloses a projector. The projector includes a device housing, a heat dissipator, a heat conducting tube, a light source and a heat dissipation fan; the device housing is provided witha heat dissipation window; the heat dissipator is fixed in the device housing; one end of the heat conducting tube contacts with a periphery of the heat dissipator, and the other end of the heat conducting tube extends in a curved manner relative to the heat dissipator; the light source includes a circuit board and multiple lamp beads arranged on the circuit board in an array; one side, deviated from the multiple lamp beads, of the circuit board is provided with a heat conducting substrate; the heat conducting substrate is embedded with one end, far away from the heat dissipator, of the heat conducting tube; the multiple lamp beads of the array obtain a light-emitting drive signal via the circuit board; and the heat dissipation fan is fixed in the device housing, is located on one side, far away from the heat dissipation window, of the heat dissipator, and blows an airflow to the heat dissipator. The heat dissipator may absorb increased heat of the light source by using the heat conducting tube, and thus the heat dissipation efficiency is increased.
Description
technical field [0001] The present application relates to the field of electronic equipment, in particular to a projector. Background technique [0002] At present, the projection light source in the projector generates a large amount of heat. A heat pipe and a heat plate are often installed inside the projector. The heat is dissipated to achieve cooling of the heat source. However, the efficiency of the current hot plate absorbing the circuit board is not high, resulting in low heat dissipation efficiency of the heat source. Contents of the invention [0003] The present application provides a projector. [0004] The present application provides a projector, wherein the projector includes a device housing, a heat sink, a heat pipe, a light source and a heat dissipation fan, the device housing is provided with a heat dissipation window, and the heat sink is fixed to the device housing In the body, it is docked with the heat dissipation window, one end of the heat pipe i...
Claims
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Login to View More IPC IPC(8): G03B21/16
CPCG03B21/16
Inventor 蔡廷昌胡震宇
Owner SHENZHEN HUOLE TECH DEV CO LTD