Sealing equipment and sealing method
A technology of sealing glue and equipment, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems that the amount of glue applied on the periphery of the wafer is difficult to be uniform, the cutting of the wafer cannot be carried out smoothly, and the yield rate is reduced. Improve the yield rate, avoid pollution, and overcome the effect of uneven glue coating
Active Publication Date: 2021-07-23
HIMAX TECH LTD
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Problems solved by technology
[0002] In some wafer manufacturing processes, the peripheries of multiple wafers stacked on top of each other need to be sealed to avoid unexpected offset and incomplete alignment between wafers. Make subsequent wafer dicing impossible to proceed smoothly
The conventional wafer manufacturing process is to manually seal the periphery of multiple wafers stacked on each other. This sealing method is likely to cause the surface of the wafer to be polluted by glue and reduce its yield, and the periphery of the wafer The amount of glue applied is difficult to be uniform
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[0037] figure 1 It is a perspective view of a sealing device according to an embodiment of the present invention. figure 2 draw figure 1 The holding unit is separated from the drive unit. Please refer to figure 1 and figure 2 , the sealing device 100 of this embodiment is suitable for sealing the peripheral edges 52 of a plurality of wafers 50 stacked on top of each other. The sealing device 100 includes a base 110 , a holding unit 120 , a driving unit 130 , a gluing unit 140 and a curing unit 150 . The holding unit 120 is, for example, a chuck and is suitable for holding the stacked wafers 50 by its suction force, and the holding unit 120 is suitable for being placed on the base 110 .
[0038] The driving unit 130 is, for example, a rotating shaft that can automatically rotate at a constant speed. It is configured on the base 110 and is suitable for carrying the holding unit 120 , and is suitable for driving the holding unit 120 and the wafers 50 to rotate. The holdin...
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A sealing device, suitable for sealing the periphery of a plurality of superimposed wafers. The sealing equipment includes a base, a holding unit, a driving unit, a glue applying unit and a curing unit. The holding unit is suitable for holding the stacked wafers and is suitable for being placed on the base. The driving unit is configured on the base and is suitable for driving the holding unit and the wafers to rotate. The gluing unit is arranged on the base and is aligned with the peripheries of the wafers. The gluing unit is adapted to gluing the peripheries of the wafers as they rotate. The solidification unit is arranged on the base and is positioned on the periphery of the wafers. The curing unit is adapted to cure the glue on the peripheries of the wafers as the wafers are rotated. In addition, a sealing method is also mentioned.
Description
technical field [0001] The present invention relates to a processing device and a processing method, and in particular to a sealing device and a sealing method. Background technique [0002] In some wafer manufacturing processes, the peripheries of multiple wafers stacked on top of each other need to be sealed to avoid unexpected offset and incomplete alignment between wafers. Make subsequent wafer dicing impossible to proceed smoothly. The conventional wafer manufacturing process is to manually seal the periphery of multiple wafers stacked on each other. This sealing method is likely to cause the surface of the wafer to be polluted by glue and reduce its yield, and the periphery of the wafer The amount of glue applied is difficult to be uniform. Contents of the invention [0003] The invention provides a glue sealing device and a glue sealing method, which can improve the yield rate of wafers and make the amount of glue applied uniform. [0004] The sealing equipment o...
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IPC IPC(8): H01L21/56H01L21/67H01L21/683
CPCH01L21/56H01L21/67126H01L21/683
Inventor 张瑞堂
Owner HIMAX TECH LTD