Sealing equipment and sealing method
A sealing and equipment technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer cutting cannot be carried out smoothly, the amount of glue on the periphery of the wafer is difficult to be uniform, and the yield rate is reduced. Improve yield, avoid contamination, overcome the effect of uneven coating
Active Publication Date: 2020-02-07
HIMAX TECH LTD
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Problems solved by technology
[0002] In some wafer manufacturing processes, the peripheries of multiple wafers stacked on top of each other need to be sealed to avoid unexpected offset and incomplete alignment between wafers. Make subsequent wafer dicing impossible to proceed smoothly
The conventional wafer manufacturing process is to manually seal the periphery of multiple wafers stacked on each other. This sealing method is likely to cause the surface of the wafer to be polluted by glue and reduce its yield, and the periphery of the wafer The amount of glue applied is difficult to be uniform
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[0037] figure 1 It is a perspective view of a sealing device according to an embodiment of the present invention. figure 2 draw figure 1 The holding unit is separated from the driving unit. Please refer to figure 1 and figure 2 , the sealing device 100 of this embodiment is suitable for sealing the peripheral edges 52 of a plurality of wafers 50 stacked on top of each other. The sealing device 100 includes a base 110 , a holding unit 120 , a driving unit 130 , a gluing unit 140 and a curing unit 150 . The holding unit 120 is, for example, a chuck and is suitable for holding the stacked wafers 50 by its suction force, and the holding unit 120 is suitable for being placed on the base 110 .
[0038] The driving unit 130 is, for example, a rotating shaft that can automatically rotate at a constant speed. It is configured on the base 110 and is suitable for carrying the holding unit 120 , and is suitable for driving the holding unit 120 and the wafers 50 to rotate. The hold...
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Sealing equipment is suitably used for sealing a circumferential edge of a plurality of wafers arranged in a lamination way. The sealing equipment comprises a substrate, a retaining unit, a driving unit, a gluing layer and a curing unit, wherein the retaining unit is suitably used for retaining the wafers arranged in a lamination way and is suitably arranged on the substrate, the driving unit is arranged on the substrate and is suitably used for driving the retaining unit and the wafers to rotate, the gluing unit is arranged on the substrate and is aligned to peripheral edges of the wafers, the gluing unit is suitably used for gluing the peripheral edges of the wafer with rotation of the wafers, the curing unit is arranged on the substrate and is aligned to the peripheral edges of the wafers, and the curing unit is suitably used for curing glue on the peripheral edges of the wafers with rotation of the wafers. Moreover, a gluing method is also provided.
Description
technical field [0001] The present invention relates to a processing device and a processing method, and in particular to a sealing device and a sealing method. Background technique [0002] In some wafer manufacturing processes, the peripheries of multiple wafers stacked on top of each other need to be sealed to avoid unexpected offset and incomplete alignment between wafers. Make subsequent wafer dicing impossible to proceed smoothly. The conventional wafer manufacturing process is to manually seal the periphery of multiple wafers stacked on each other. This sealing method is likely to cause the surface of the wafer to be polluted by glue and reduce its yield, and the periphery of the wafer The amount of glue applied is difficult to be uniform. Contents of the invention [0003] The invention provides a glue sealing device and a glue sealing method, which can improve the yield rate of wafers and make the amount of glue applied uniform. [0004] The sealing equipment o...
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IPC IPC(8): H01L21/56H01L21/67H01L21/683
CPCH01L21/56H01L21/67126H01L21/683
Inventor 张瑞堂
Owner HIMAX TECH LTD