Embedded circuit board and manufacturing method thereof

Abstract

A method for manufacturing an embedded circuit board, which includes the following steps: providing an additional circuit board, including a flexible base layer and a first conductive circuit layer and a second conductive circuit layer respectively formed on two opposite surfaces of the base layer ; Press the photosensitive material on the surface of the first conductive circuit layer on the additional circuit board to form a photosensitive material layer, and selectively remove part of the photosensitive material layer to form a mounting groove; place the component in the mounting groove and install it on the first conductive circuit layer and conduction with the first conductive circuit layer; press the two copper plates to the second conductive circuit layer and the exposed two surfaces of the photosensitive material layer through the adhesive layer, thereby forming an embedded core material, the copper plate includes a flexible Insulating base film and the third copper layer; and drilling, electroplating, and circuit processing for the embedded core material, so that the components, the additional circuit board and the two third conductive circuit layers formed by the two third copper layers on the outer layer conduction to form an embedded circuit board. The invention also provides an embedded circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to an embedded circuit board and a manufacturing method thereof. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and the demand for miniaturization, multi-function and high performance is getting higher and higher. As the main component of electronic products, circuit boards occupy a large space of electronic products, so the volume of circuit boards affects the volume of electronic products to a large extent. By embedding electronic components (such as resistors, capacitors, etc.) The interior of the circuit substrate is conducive to reducing the overall thickness of the circuit board, thereby reducing the thickness of electronic products. At present, the internal embedding method of electronic components is to make multi-layer flexible circuit board empty board products, open holes at a fixed depth on ...

AI Technical Summary

Problems solved by technology

At present, the internal embedding method of electronic components is to make multi-layer flexible circuit board empty board products, open holes at a fixed depth on the multi-layer flexible circuit board, and place electronic components in the cavity of the multi-layer flexible circuit board. , but this method has a large technical bottleneck in the fixed depth opening and electronic component installation process in the hole, and the cost is high

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