Embedded circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of an embedded circuit board. The manufacturing method comprises the following steps of: providing an additional circuit board, wherein the additional circuit board comprises a flexible base layer and a first conductive circuit layer and a second conductive circuit layer which are respectively formed on the two opposite surfaces of the base layer; laminating a photosensitive material on the surface of the first conductive circuit layer of the additional circuit board so as to form a photosensitive material layer, and selectively removing a part ofthe photosensitive material layer to form a mounting groove; placing a component in the mounting groove, installing the component on the first conductive circuit layer and causing the component to communicate with the first conductive circuit layer; laminating two copper plates on the two exposed surfaces of the second conductive circuit layer and the photosensitive material layer through adhesivelayers, thereby forming an embedded core material, wherein each copper plate comprises a flexible insulated base membrane and a third copper layer; drilling the embedded core material, electroplatingthe embedded core material, and processing circuits on the embedded core material, so that the component, the additional circuit board, and two third conductive circuit layers formed by two third copper layers on the outer layer are in conduction to form the embedded circuit board. The invention also provides the embedded circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to an embedded circuit board and a manufacturing method thereof. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and the demand for miniaturization, multi-function and high performance is getting higher and higher. As the main component of electronic products, circuit boards occupy a large space of electronic products, so the volume of circuit boards affects the volume of electronic products to a large extent. By embedding electronic components (such as resistors, capacitors, etc.) The interior of the circuit substrate is conducive to reducing the overall thickness of the circuit board, thereby reducing the thickness of electronic products. At present, the internal embedding method of electronic components is to make multi-layer flexible circuit board empty board products, open holes at a fixed depth on ...

AI Technical Summary

Problems solved by technology

At present, the internal embedding method of electronic components is to make multi-layer flexible circuit board empty board products, open holes at a fixed depth on the multi-layer flexible circuit board, and place electronic components in the cavity of the multi-layer flexible circuit board. , but this method has a large technical bottleneck in the fixed depth opening and electronic component installation process in the hole, and the cost is high

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