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High-density Micro LED sandwich structure active driving display unit

A sandwich structure and display unit technology, which is applied to electrical components, instruments, electric solid devices, etc., can solve the problem that it is difficult to further reduce the pixel pitch of LED display units, etc.

Active Publication Date: 2020-02-11
JIHUA LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, limited by the carrier board and driving technology, it is difficult to further reduce the pixel pitch of the LED display unit

Method used

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  • High-density Micro LED sandwich structure active driving display unit
  • High-density Micro LED sandwich structure active driving display unit
  • High-density Micro LED sandwich structure active driving display unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] In order to solve the problem that there will be gaps in the splicing of LED display screens using TFT display drive circuits, the present invention grows metal pillars on one side of the transparent glass carrier board with the LED flip-chip structure light-emitting chip that emits light from the reverse side, and grows metal pillars on the opposite side of the printed circuit carrier board. The metal pad pillars grown in corresponding positions are butted to lead the driving circuit to the printed circuit carrier. Taking the LED flip-chip structure light-emitting chip that emits light from the reverse side as an example, the specific technical solution of the present invention is as follows:

[0052] Such as Figure 5 As shown, J2 is the LED flip-chip structure light-emitting chip that emits light from the reverse side, G2 is the light-emitting surface of the LED flip-chip structure light-emitting chip J2, G is the transparent glass carrier that fixes the LED flip-chi...

Embodiment 2

[0060] In order to solve the problem that there will be gaps in the splicing of LED display screens using TFT display drive circuits, the invention fixes the LED flip-chip structure light-emitting chips on the back of the transparent glass carrier, and prints the leads on the transparent glass carrier through metal columns. The lead connections on the circuit carrier lead the drive circuit to the printed circuit carrier. Taking the LED flip-chip structure light-emitting chip that emits light from the reverse side as an example, the specific technical solution of the present invention is as follows:

[0061] Such as Figure 5 As shown, J2 is the LED flip-chip structure light-emitting chip that emits light from the reverse side, G2 is the light-emitting surface of the LED flip-chip structure light-emitting chip J2, G is the transparent glass carrier that fixes the LED flip-chip structure light-emitting chip J2, and J4 is the LED flip-chip structure The electrode of the light-em...

Embodiment 3

[0068] Such as Figure 13 As shown, the active driving display unit of the high-density Micro LED sandwich structure of the present invention includes a transparent glass carrier G, a printed circuit carrier B, a basic pixel unit, a TFT driving device T, and a circuit driver J20; the basic pixel unit includes The red, green and blue three-primary-color LED light-emitting chips P2, P3 and P4, and the red, green and blue three-primary-color LED light-emitting chips P2, P3 and P4 all use reverse-side LED flip-chip structure light-emitting chips, and other structural forms can also be used. The LED light-emitting chip emitting light from the reverse side; the two electrodes J4 of the LED flip-chip structure light-emitting chip are bonded to the two electrodes of the TFT driving device T through the glass carrier pad J6; the TFT driving device T is fixed on the transparent glass carrier G, It is used to drive the LED flip-chip light-emitting chip to emit light, and the TFT driving de...

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Abstract

The invention relates to a high-density Micro LED sandwich structure active driving display unit. Three primary-color LED light-emitting chips of the display unit are fixed on the back of a transparent glass carrier board, and the LED light-emitting chips emit light on the reverse side. The array of TFT drive devices grow on the back of the transparent glass carrier board. The electrodes of the TFT drive devices are bonded to the electrodes of the LED light-emitting chips. Circuit drive devices are distributed and fixed on a printed circuit carrier board, and the lead pad of the glass carrierboard and the lead pad of the circuit carrier board are connected through a metal post. The circuit drive devices are connected with the TFT drive devices through the lead of the circuit carrier board, the lead pad of the circuit carrier board, the metal post, the lead of the glass carrier board, and the lead pad of the glass carrier board. According to the invention, seamless splicing of a display screen is realized, and the reliability is great.

Description

technical field [0001] The invention belongs to the technical field of high-density LED display, flat panel display and semiconductor material, and relates to a large-scale high-density Micro LED active drive display unit that can be seamlessly spliced. Background technique [0002] At present, the world has begun to enter the era of large-screen high-resolution high-end digital flat panel display. This new type of flat panel display industry is a strategic emerging industry with an annual output value of more than 100 billion U.S. dollars. It is a leading pillar industry in the information age. Radiation is strong. With the continuous advancement of LED display technology, high-density small-pitch high-definition large-screen LED display products have become one of the most important display devices. With the incomparable seamless and infinite splicing advantages of DLP and LCD, it is the only one in my country that can stand in the world's advanced ranks. display products....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/49H01L33/62G09F9/33
CPCG09F9/33H01L23/49H01L25/162H01L25/167H01L33/62H01L2224/16225H01L2224/48091H01L2224/97H01L2924/00014
Inventor 王瑞光郑喜凤陈宇马新峰汪洋
Owner JIHUA LAB
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