Calibration method of manipulator, calibration device and semiconductor processing device

Abstract

The invention discloses a calibration method of a manipulator, a calibration device and a semiconductor processing device. The calibration method comprises the following steps that the manipulator iscontrolled to enter a coarse taking position to take the test wafer, and the coarse expansion radius and the coarse rotation angle of the manipulator in the coarse taking position are recorded; the manipulator is controlled to place the test wafer onto a linear calibrator for calibration to obtain the circle center offset and the rotation angle offset of the test wafer; and according to the coarseexpansion radius, the coarse rotation angle, the circle center offset and the rotation angle offset, the precision taking position of the manipulator is determined. The method can realize automatic rapid finding of the coarse taking position, and can automatically and quickly determine the precision taking position of the manipulator at each process position, so that the process position error caused by human factors can be avoided, and later device maintenance is facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a method for calibrating a manipulator, a calibrating device for a manipulator, and a semiconductor processing device. Background technique [0002] In semiconductor processing equipment, robots are generally used to transfer wafers. After the equipment is assembled or when the equipment is regularly repaired and maintained, the engineer needs to perform the maintenance of the manipulator and the calibration of the transfer station to ensure that the wafer can accurately fall directly above the electrostatic chuck of the process chamber. If the center of the wafer deviates from the center of the electrostatic chuck, the wafer will not be electrostatically adsorbed for subsequent processing, and the wafer and the manipulator are prone to collision and friction during the wafer transfer process, resulting in a large amount of particulate matter contaminating the waf...

AI Technical Summary

Problems solved by technology

However, due to the narrow space and dark light inside the process chamber, different operators have different observation angles and methods, resulting in the positioning of the manipulator requiring repeated operations many times, and the calibration accuracy is low, and the direction of the manipulator cannot be calibrated, resulting in potential failures

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