Manufacturing method of metal blind groove of circuit board
A manufacturing method and circuit board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems affecting product delivery, peeling, and circuit board quality degradation, so as to improve the problem of plating peeling and increase the production efficiency The effect of adhesion and improving the overall quality
Active Publication Date: 2021-07-20
GUANGZHOU FASTPRINT CIRCUIT TECH +2
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, during the electroplating process, the plating layer formed in the tank usually peels off from the substrate, resulting in an overall decline in the quality of the circuit board and seriously affecting the delivery date of the product
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0030] In order to clarify the purposes of the present invention, the present invention will be further detailed in connection with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to explain the present invention and does not limit the scope of the invention.
[0031] It should be noted that when the element is referred to as "fixed to" another element, it can be directly in another element or may also exist. When a component is considered to be "connected" another element, it may be directly connected to another element or may always exist in the center element. The term "vertical", "horizontal", "left", "right", "left", "right", "left", "right", and similar expressions are not shown, as unique embodiments.
[0032] All techniques and scientific terms used herein are identical to those skilled in the art, unless otherwise defined. The terminology used in the specification of the present invent...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| width | aaaaa | aaaaa |
| depth | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a method for manufacturing a metal blind groove of a circuit board. A region to be grooved is arranged on the circuit board, and the region to be grooved is grooved so that a blind groove is formed on the circuit board; Holes are made on the bottom of the blind groove so that the first attachment hole is formed at the bottom of the blind groove. In this way, when the circuit board is sinking copper, metal copper will be attached to the first attachment hole; after the metal copper is attached, the circuit board is then placed on the board surface. Electroplating, at this time, the plating layer formed at the bottom of the blind groove will be connected to the metal copper in the first attachment hole, so that the adhesion between the plating layer and the substrate in the blind groove can be improved through the metal copper in the first attachment hole , so that the coating is closely combined with the blind groove, reducing the incidence of the coating being peeled off from the substrate, and ensuring the normal delivery of the product. Since the first attachment hole is extended along the circumferential direction of the blind slot, the first attachment hole in this embodiment has a ring structure, which further improves the adhesion between the coating and the base material in the blind slot.
Description
Technical field [0001] The present invention relates to the field of wire board processing, and in particular, to a method of fabricating a metal blind groove of a circuit board. Background technique [0002] With the rapid development of the electronics industry, the demand for board boards is getting bigger and larger, and more and more features on the board. Currently, the circuit board design mainly tends to compute and integrate, and a large number of components are integrated on a circuit board to achieve a variety of different functions. However, as components are largely integrated on the circuit board, the space on the board is extremely crowded. In order to expand the installation space on the board, metal blind grooves are typically opened on the board, which is mounted in the power amplifier slot to slow down the congestion on the board. [0003] Traditional metal blind grooving process generally slots on the circuit board; after opening, the circuit board sequentiall...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4697
Inventor 许龙龙陈黎阳
Owner GUANGZHOU FASTPRINT CIRCUIT TECH