Multi-reactor solution polymerization, polyethylene and polyethylene films
A polyethylene and reactor technology, applied in the multi-reactor solution polymerization, polyethylene and polyethylene film fields, can solve problems such as undisclosed or expected problems
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Embodiment approach A
[0428] Embodiment A. A polyethylene product composition comprising:
[0429] 35 to 75 wt% of the first polyethylene having a density of 0.875 to 0.916 g / cm 3 , melt index I 2 0.1 to 5dg / min and molecular weight distribution M w / M n ethylene copolymers of 1.6 to 2.4;
[0430] 10 to 40 wt % of a second polyethylene selected from the group consisting of a density of 0.945 to 0.975 g / cm 3 , melt index I 2 1.0 to 20 dg / min and molecular weight distribution M w / M n An ethylene copolymer or ethylene homopolymer of 1.6 to 2.4; and
[0431] 10 to 40 wt% of a third polyethylene having a density of 0.880 to 0.936 g / cm 3 , melt index I 2 0.1 to 100 dg / min and molecular weight distribution M w / M n greater than the molecular weight distribution M of the first or second ethylene polymer component w / M n ethylene copolymer;
[0432] The density of the polyethylene product composition is less than or equal to 0.939 g / cm 3 , melt index I 2 From 0.1 to 10 dg / min, with a unimod...
Embodiment approach LL
[0472] Embodiment LL. A film layer comprising the ethylene polymer composition of Embodiment A.
[0473] Implementation MM. The film layer of Embodiment LL, wherein the film has a machine direction (MD) 1% secant modulus > 170 MPa.
[0474] Implementation NN. The film layer of Embodiment LL or MM, wherein the film has a dart impact strength > 500 g / mil.
[0475] Embodiment OO. The film layer of Embodiment LL, MM, or NN, wherein the film has a seal initiation temperature (SIT) < 105°C.
[0476] Embodiment PP. The film layer of embodiment LL, MM, NN, or OO, wherein the film has a slow puncture resistance value > 65 J / mm.
Embodiment approach QQ
[0477] Implementation QQ. The film layer of Embodiment LL, MM, NN, OO, or PP, wherein the film has a machine direction (MD) tear of > 250 g / mil.
[0478] Implementation RR. The film layer of Embodiment LL, MM, NN, OO, PP, or QQ, wherein the film has a machine direction (MD) tensile strength at break > 40 MPa.
[0479] Implementation SS. The film layer of Embodiment LL, MM, NN, OO, PP, QQ, or RR, wherein the film has a haze < 14%.
[0480] Implementation TT. A film layer with dart impact strength ≥ 600 g / mil, MD 1% secant modulus ≥ 170 MPa, slow puncture value ≥ 65 J / mm, machine direction (MD) tear ≥ 250 g / mil , and the sealing initiation temperature (SIT)≤105℃.
[0481] Embodiment UU. The film layer of Embodiment TT, wherein the film has a MD tensile strength at break > 40 MPa.
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Abstract
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