Semiconductor refrigeration assembly and refrigerator
A semiconductor and component technology, applied in the field of semiconductor refrigeration components and refrigerators, can solve the problem of low heat exchange efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0034] Example one
[0035] Such as figure 1 As shown, the embodiment of the present invention provides a semiconductor refrigeration component, please refer to figure 1 with figure 2 ,among them figure 1 Is an exploded view of semiconductor refrigeration components, figure 2 It is a combination diagram of a semiconductor refrigeration component, where the semiconductor refrigeration component may include: a cold end radiator 1, a conductive cold block 2, a semiconductor refrigeration sheet 3, a plastic middle frame 4, and a hot end radiator 5; The frame 4 is used to assemble the cold-end radiator 1, the cold-conducting block 2, the semiconductor refrigeration fin 3, and the hot-end radiator 5 together in sequence; the cold-end radiator 1 and the A heat-insulating layer 6 is also arranged between the hot-end radiators 5, and the thickness of the heat-insulating layer 6 is the sum of the thicknesses of the cold conducting block 2 and the semiconductor refrigeration fin 3;
[0036]...
Example Embodiment
[0050] Example two
[0051] The embodiment of the present invention also provides a refrigerator, please refer to Figure 8 with Picture 9 ,among them Figure 8 Shows the structure of the outside of the rear wall of the refrigerator body, Picture 9 The structure inside the rear wall of the refrigerator body is shown, including: the refrigerator body 20 and the semiconductor refrigeration assembly 10 as described in any one of the first embodiment; the semiconductor refrigeration assembly 10 is arranged on a target side wall of the refrigerator body 20 And the semiconductor refrigeration assembly 10 is arranged vertically, the cold end heat sink in the semiconductor refrigeration assembly 10 is located inside the target side wall, and the hot end heat sink in the semiconductor refrigeration assembly 10 is located at the target Lateral side
[0052] The target side wall is formed with air duct structures 101-103, the air duct is connected to the storage bin of the refrigerator body...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap