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A kind of manufacturing method of three-color LED lamp bead

A technology of LED lamp beads and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of complex manufacturing methods, unsatisfactory light emitting angles and consistency of products, and achieve improved smoothness, The effect of tight arrangement and simple operation

Active Publication Date: 2021-01-19
安晟技术(广东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing CSP LEDs usually emit light from five sides, that is, the top surface and four sides of the LED chip can emit light. The process of five-sided light emission is relatively simple, but it cannot meet the requirements for the angle and consistency of the light emitted by the product.
At present, the manufacturing method of single-sided LED chip CSP is relatively complicated.

Method used

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  • A kind of manufacturing method of three-color LED lamp bead
  • A kind of manufacturing method of three-color LED lamp bead
  • A kind of manufacturing method of three-color LED lamp bead

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Experimental program
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Embodiment Construction

[0041] The manufacturing method of the three-color LED lamp bead of this embodiment includes the following steps:

[0042] Step A: If figure 1 (A) and figure 2 As shown, the UV film 1 is prepared, the edge of the UV film 1 is provided with a process edge 2, and a matrix array of substrates 3 is pasted in the area surrounded by the process edge 2 on the UV film 1, and the matrix array is full of the area. The process side 2 is provided with positioning marks 4 corresponding to the matrix array. In the matrix array, the substrates 3 are arranged in parallel so as to be connected to each other. In this embodiment, the UV film 1 is rectangular, and the process side 2 is arranged on four sides of the UV film 1; the substrate 3 is a square aluminum substrate.

[0043] Step B: If figure 1 (B) and figure 2 As shown, according to the positioning mark 4, the three-color LED CSP 5 is connected to each substrate 3 with solder paste. CSPs can be connected to each substrate 3 in a c...

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Abstract

The invention relates to a manufacturing method of a three-color LED lamp bead, comprising the following steps: Step A, preparing a UV film, the edge of which is provided with a process edge, and pasting a matrix array of a substrate on the area surrounded by the process edge on the UV film, wherein the process edge is provided with a positioning mark corresponding to the matrix array; Step B, connecting a three-color LED CSP to each substrate with solder paste according to the positioning mark; Step C, forming a semi-spherical mold top glue covering the three-color LED CSP on each substrate by a mold top molding process according to the positioning mark; and Step D, peeling each substrate from the UV film after treating the UV film with UV so as to obtain a three-color LED lamp bead. According to the invention, the three-color LED lamp beads are manufactured in batch by the above method.

Description

technical field [0001] The invention relates to the technical field of LED lamp manufacturing, in particular to a method for manufacturing a three-color LED lamp bead. Background technique [0002] LED light sources have the advantages of energy saving, environmental protection, safety and reliability, and stable light emission, and are gradually replacing traditional light sources. However, at present, LED lamp beads are difficult to manufacture in batches, and the production efficiency is low. In addition, the traditional LED chip packaging process is to dispense glue to the LED chips one by one, which is time-consuming and difficult to control and reduce the volume and thickness of the LED chip package. The new chip-scale packaging technology, CSP, can reduce the packaging volume, make the package thinner, and help heat dissipation. Existing CSP LEDs usually emit light from five sides, that is, the top surface and four sides of the LED chip can emit light. The process o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/62H01L21/78
CPCH01L21/78H01L33/54H01L33/62
Inventor 麦家通戴轲
Owner 安晟技术(广东)有限公司
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