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Method and device for checking IC device shell pin

A technology for integrated circuits and pins, which is used in the field of checking and evaluating the layout status of flat-type integrated circuit package pins, and can solve problems such as reliability degradation

Inactive Publication Date: 2003-05-14
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, even if the IC package is held accurately, the device is judged to be defective regardless of the layout of the pins, that is, the reliability of the inspection is lowered

Method used

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  • Method and device for checking IC device shell pin
  • Method and device for checking IC device shell pin
  • Method and device for checking IC device shell pin

Examples

Experimental program
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Embodiment Construction

[0021] Please refer to Figure 6 and Figure 7 , the device for inspecting pins according to the present invention includes: suction nozzle 211, which is movably installed to pick up and hold an integrated circuit package 10; at least three pairs of light emitters 221, 222, 223 and detectors 231, 232, 233, the light emitter and the detector are arranged facing each other, and a row of pins 12 of the integrated circuit package 10 held by the suction nozzle 211 is arranged between them; the controller 240 is used to measure each light emitter 221, 222 and 223 The amount of light emitted bypassing the pins 12 and passing between the pins 12 and then reaching the corresponding detectors 231 , 232 and 233 is used to evaluate the layout state of the pins 12 .

[0022] The optical axis formed by emitter 222 and detector 232 has an angle θ with respect to the optical axis formed by emitter 221 and detector 231, which itself has an angle θ with respect to the optical axis formed by em...

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PUM

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Abstract

The invention provides a device used to check the pins of a flat pack-type integrated circuit package shell, which comprises more than three pairs of illuminators and detectors, which are opposite to each other. The pins of the integrated circuit package shell are arranged between the illuminators and the detectors. A function is constructed by the angle of an optical axes formed by the illuminators and the detectors and the quantity of light measured by the detectors as variables. The maximum acceptance angle and the maximum light absorption can be got from the minimal value of the obtained function. The layout of the pins can be appraised by comparing the maximum light income with the reference value.

Description

technical field [0001] The invention relates to a method and device for inspecting and evaluating integrated circuit packaging pins, in particular to a method and device for inspecting and evaluating the layout state of flat integrated circuit packaging pins. Background technique [0002] Generally speaking, a flat integrated circuit package 10, such as a quad flat package (QFP), includes a main body 11 and a plurality of pins 12 arranged on the sides of the main body 11, see figure 1 . As shown in the figure, the lead 12 includes: an extending portion 121 extending horizontally from the package body 11 ; an inclined portion 122 extending downward at a predetermined angle; and an end portion 123 extending horizontally from the inclined portion 122 . [0003] When the integrated circuit package 10 is mounted on a printed circuit board (not shown), the attitude, orientation, inclination and height of all pins 12 should be the same so that all pins 12 are in contact with the c...

Claims

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Application Information

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IPC IPC(8): H01L23/00G01B11/24G01B11/245G01R31/26H01L21/66
CPCH01L22/00
Inventor 卞钟垠
Owner SAMSUNG ELECTRONICS CO LTD