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A pcb cooling device

A technology of heat dissipation device and PCB board, which is applied to circuit thermal devices, printed circuit components, printed circuits, etc., can solve the problems of inconvenient production and assembly, complicated installation, and high product cost, achieve simple and reliable installation methods, and reduce production. cost, the effect of streamlining the production process

Active Publication Date: 2021-09-07
HANGZHOU INST OF ADVANCED TECH CHINESE ACAD OF SCI +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding the heat dissipation technology of the PCB board, the commonly used methods are: 1) Paste the heat dissipation aluminum sheet on the power tube or the heating core. In the air, the space temperature is high, which affects the life of electronic devices, and at the same time, the production and assembly are not convenient; 2) Install cooling modules such as cooling fans or water-cooling tubes on the PCB. The disadvantage of this method is that installation is troublesome and the product cost is high.
[0003] To sum up, the traditional heat dissipation cannot solve the heat dissipation problem of some electronic devices on the PCB in a targeted manner. At the same time, there are complicated installation and high cost.

Method used

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Embodiment Construction

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0025] see Figure 1-Figure 5 , a high-efficiency and low-cost PCB coo...

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Abstract

The invention relates to the field of PCB board circuits, in particular to a PCB cooling device. A high-efficiency and low-cost PCB cooling device, including a PCB board, a chip and a heating device are arranged on the PCB board, through holes are provided on the PCB board, mounting holes are arranged on the heating device, and the mounting holes are connected to the PCB board. The through-hole concentric setting. The invention is a high-efficiency and low-cost PCB cooling device, which can reduce the thermal resistance in the heat conduction process, realize high-efficiency conduction and heat dissipation to the shell in a short distance in a small space, simplify the fixing method of the heat sink, reduce installation difficulty and save material costs .

Description

technical field [0001] The invention relates to the field of PCB board circuits, in particular to a high-efficiency and low-cost PCB cooling device. Background technique [0002] In a PCB circuit containing heating components such as power tubes, magnetic core devices, and power resistors, the heat dissipation capability directly affects the maximum working environment temperature and product life of the product as a whole. Regarding the heat dissipation technology of the PCB board, the commonly used methods are: 1) Paste the heat dissipation aluminum sheet on the power tube or the heating core. In the air, the space temperature is high, which affects the life of electronic devices, and at the same time, production and assembly are not convenient; 2) Install cooling modules such as cooling fans or water-cooling tubes on the PCB. The disadvantage of this method is that installation is troublesome and the product cost is high. [0003] To sum up, the traditional heat dissipat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0203H05K1/0206H05K1/021H05K1/18H05K2201/066
Inventor 周江涛田鹏黄海金
Owner HANGZHOU INST OF ADVANCED TECH CHINESE ACAD OF SCI
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