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Micro-led display and manufacturing method therefor

A LED display and display technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as inapplicability of near-field displays, and achieve the effect of improving yield

Pending Publication Date: 2020-03-06
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in order to realize this display, it is first necessary to develop micro-LEDs (μLEDs) corresponding to current pixels, and there are still some problems to be solved, such as how to pick up micro-LEDs of tens of micrometers (μm), how to precisely place micro-LEDs Placement on the printed circuit board (PCB), and how the input / output terminals are arranged to be electrically coupled to the main PCB
[0004] In the case of displays using LED packages, it is not suitable for near-field displays because LED packages with a size of several millimeters (mm) are basically used

Method used

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  • Micro-led display and manufacturing method therefor
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  • Micro-led display and manufacturing method therefor

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Embodiment Construction

[0030] Hereinafter, various embodiments of the present disclosure are described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the technical features set forth herein to specific embodiments, but includes various changes, equivalents or replacements to the embodiments of the present disclosure. With respect to the description of the figures, like reference numerals may be used to designate like or related elements.

[0031] The expressions "has", "may have", "include" or "may include" etc. used in this disclosure are intended to indicate that there are corresponding features (eg, numbers, functions, operations or components, such as components), and should It is understood that there is an additional possibility of one or more other features.

[0032] In the present disclosure, the expression "A or B", "A and / or B", or "one or more of A and / or B", etc. may include all possible combinations of items listed toget...

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Abstract

A micro-LED display is disclosed. The disclosed display comprises: a printed circuit board including a plurality of solder pads; a micro-LED package including a plurality of micro-LED chips; and a plurality of solder electrodes for joining the micro-LED chips onto the solder pads of the printed circuit board, wherein the micro-LED package can be re-arranged in an RGB state on a temporarily fixed film by using a pickup device, in accordance with a display pixel configuration, after the micro-LED chips are attached to a carrier film.

Description

technical field [0001] Various embodiments of the present disclosure relate to micro light emitting diode (LED) displays and methods of manufacturing the same. Background technique [0002] Although Organic Light Emitting Diode (OLED) panels are attracting attention as a new display to replace Liquid Crystal Display (LCD) panels, as problems to be solved, there are still high prices caused by low yield, large size, and reliability problems, etc. question. In order to compensate for this problem, research into a technique of manufacturing a display panel by directly mounting LEDs emitting red (R), green (G), and blue (B) on a substrate has been attempted. [0003] However, in order to realize this display, it is first necessary to develop micro-LEDs (μLEDs) corresponding to current pixels, and there are still some problems to be solved, such as how to pick up micro-LEDs of tens of micrometers (μm), how to precisely place micro-LEDs Placement on a printed circuit board (PCB)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L27/15H01L33/52H01L21/677H01L21/027H01L33/02
CPCH01L25/0753H01L33/0095H01L25/167H01L33/62H01L33/48H01L27/156H01L33/52H01L21/67712H01L21/67721H01L21/027H01L33/02H01L33/0093H01L2933/005H01L2933/0066
Inventor 李溁澈朴泰相李珓吏李泽模许均文永俊崔源
Owner SAMSUNG ELECTRONICS CO LTD