Multilayer synchronous constant pressure pressing machine of high-sensitivity circuit board

Abstract

The invention relates to a multilayer synchronous constant pressure pressing machine of a high-sensitivity circuit board which is suitable for high-sensitivity circuit board pressing, and belongs to the electromechanical integration electronic equipment manufacturing technology field. A hot plate group is arranged in the pressing machine. The hot plate group is a simultaneous closed structure. Thesimultaneous closed structure consists of multiple layers of hot plates. A supporting rod is fixedly arranged on a first-layer hot plate at a lower end. A hot plate fixing point is arranged on the uppermost layer of hot plate. Movable pulleys and the supporting rods are arranged on the other hot plates. One end of a stress rope is fixed on the upper-layer hot plate through the movable pulley, theother end is fixed on the supporting rod of the lower-layer hot plate, a lower end of the supporting rod is fixed on the lower-layer hot plate of the hot plate where the movable pulley is located through a fixing bolt, and the hot plates are successively and synchronously connected through the movable pulley, the stress rope and the supporting rod. All layers of hot plates in the pressing machineare closed at the same time, pressed products are good in quality, production efficiency is good, and a rate of finished products is high.

Description

technical field [0001] The present invention designs a pressing machine with simultaneous closing of hot plates, specifically a multi-layer synchronous equal-pressure pressing machine for high-sensitivity circuit boards, which is applicable to the current pressure-temperature high-sensitivity circuit board pressing, and belongs to electromechanical integration Electronic equipment manufacturing technology field. Background technique [0002] At present, the high-frequency microwave plate pressing machine adopts ordinary high-temperature pressing machine, and its structure is mostly equipped with an oil cylinder plunger, and the hot plate is closed layer by layer from bottom to top. Before the oil cylinder is pressurized, the thickness and weight of the material on each layer of hot plate are basically equal. When the plunger of the oil cylinder is pressurized and rises, the bottom heat plate starts to rise until it reaches the second heat plate, and then the second heat pla...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the unreasonable structural design of the existing circuit board pressing machine. When pressing the circuit board, the pressure on each layer of hot plate is reduced layer by layer from bottom to top, and the uppermost layer of hot plate only bears the pressure on this layer. The weight of the pressing material, the pressure and time of pressing the product between each layer are different, the product with the same parameters cannot be pressed, the produced product is not consistent, and the difference is relatively large, thus providing a new technical solution

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