COB packaging method for rapid sedimentation of light conversion material and COB device
A technology of light conversion material and packaging method, applied in the field of COB packaging method and COB device, can solve the problems of COB production process sedimentation and production efficiency contradiction, and achieve the effect of batch operation, easy operation and high viscosity
Active Publication Date: 2020-03-27
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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Problems solved by technology
[0004] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a COB packaging method and COB device in which the light conversion material rapidly settles, which can effectively solve the problem of the contradiction between the settlement and the production efficiency of the COB production process
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[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0028] A COB encapsulation method for rapid deposition of light conversion materials, the method comprising the following steps:
[0029] S1. Fix the LED chip 2 on the LED carrier 1 according to the design, and electrically connect the LED chip 2 and the LED carrier 1 with the bonding wire 3 . Such as figure 1 figure 2 As shown, the carri...
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Abstract
The invention discloses a COB packaging method for rapid sedimentation of a light conversion material and a COB device. The method comprises the steps of preassembling the LED chip and the bonding wire, filling the mixture of the light conversion material and the silica gel, coating the diluent, standing, baking and the like, so that on one hand, the high viscosity of the light conversion mixturebefore coating ensures the uniformity of the light conversion material, the production is easy to control, and the production yield is improved; by coating the diluent, the settling velocity of the light conversion particles is greatly improved, the production efficiency of the COB device is improved, the packaging method is simple and convenient to operate, extra equipment does not need to be added, batch operation can be realized, and the production efficiency of the COB device is improved.
Description
technical field [0001] The invention relates to the technical field of light-emitting diode (LED) packaging, in particular to a COB packaging method and a COB device in which light-converting materials rapidly settle. Background technique [0002] The existing COB packaging method is to mix the light conversion material with silica gel and then coat it on the LED chip. The thickness of the mixed glue is generally greater than 0.5mm, so that the heat conduction path of the light conversion material is long, and the thermal conductivity of the silica gel itself is low, resulting in light The heat absorbed by the conversion material cannot be dissipated from the bottom of the substrate in time, and the accumulated heat is increasing and the temperature is getting higher and higher, which makes the light conversion material invalid, and even causes the silicone to crack and break the bonding wire to die. [0003] In order to improve the heat dissipation characteristics, most pac...
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IPC IPC(8): H01L25/075H01L33/48H01L33/54
CPCH01L25/0753H01L33/483H01L33/54H01L2933/0033
Inventor 陈智波苏佳槟
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD