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Wafer Wet Cleaning System And Method

A technology for cleaning systems, wafers

Active Publication Date: 2020-04-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As wafers are exposed to additional processing, the number of unwanted particles on the wafer surface can increase during IC fabrication, adversely affecting wafer yield and IC performance

Method used

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  • Wafer Wet Cleaning System And Method
  • Wafer Wet Cleaning System And Method
  • Wafer Wet Cleaning System And Method

Examples

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Embodiment Construction

[0031] Many different implementation methods or examples are disclosed below to implement different features of the provided subject matter, and specific elements and embodiments of their arrangement are described below to illustrate the present disclosure. Of course, these examples are for illustration only, and should not be used to limit the scope of the present disclosure. For example, if it is mentioned in the description that the first characteristic component is formed on the second characteristic component, it may include the embodiment that the first characteristic component is in direct contact with the second characteristic component, and also includes the embodiment where the first characteristic component and the second characteristic component are in direct contact. Embodiments where there are additional features between the second features, ie, the first feature is not in direct contact with the second feature.

[0032] In addition, spatial terms such as "below"...

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PUM

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Abstract

The invention relates to a wafer wet cleaning system and method. The present disclosure describes a wafer cleaning process in which a drained cleaning solution, which is used to remove metal contaminants from the wafer, is sampled and analyzed to determine the concentration of metal ions in the solution. The wafer cleaning process includes dispensing, in a wafer cleaning station, a chemical solution on one or more waters; collecting the dispensed chemical solution; determining a concentration of contaminants in the chemical solution; in response to the concentration of the contaminants being greater than a baseline value, adjusting one or more parameters in the cleaning process; and in response to the concentration of the contaminants being equal to or less than the baseline value, transferring the one or more wafers out of the wafer cleaning station.

Description

technical field [0001] Embodiments of the present disclosure relate to a wafer wet cleaning system and method. Background technique [0002] Production equipment used in semiconductor fabrication can be a source of unwanted particles to multiple semiconductor wafers in an integrated circuit (IC) fabrication facility. During wafer fabrication, semiconductor wafers undergo multiple processing operations. As wafers are exposed to additional processing, the number of unwanted particles on the wafer surface can increase during IC fabrication, adversely affecting wafer yield and IC performance Contents of the invention [0003] In some embodiments, a wafer wet cleaning system includes a cleaning station configured to remove contaminants from one or more wafers through a cleaning process involving a chemical solution; a drain collector configured to collect a chemical solution at the station; an analyzer configured to analyze the chemical solution collected in the drain collect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02B08B3/02
CPCH01L21/67051H01L21/67253H01L21/02057B08B3/022B08B2203/0217H01L21/02052B08B3/08B08B3/10B08B2203/007
Inventor 赵志伟王恕言
Owner TAIWAN SEMICON MFG CO LTD
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