Hollow plastic plate and manufacturing method thereof

Abstract

The invention discloses a hollow plastic plate and a manufacturing method thereof. The hollow plastic plate comprises a middle hollow plate body, wherein a plurality of disordered bubbles are formed in the hollow plate body, and solid plates are fixed to a top face and a bottom face of the hollow plate body. Materials in a set proportion can be rapidly placed in a mixing device, gas mixing is adopted, the mixing effect is good, mixing is rapid, and the mixing time is greatly prolonged. The middle part of the plate contains a plurality of hollow micro bubbles, so the weight of the plate is reduced, hole walls among the bubbles form a zigzag structure, i.e., the length of the plate is increased, so the plate has better heat preservation and heat insulation capabilities, a large hollow structure is dispersed into a more uniform hollow structure, and uniformity of the bearing pressure of the plate is improved.

Description

technical field [0001] The invention belongs to the field of materials, in particular to a method for making a hollow plastic plate. Background technique [0002] The existing hollow plastic sheet usually inserts a rod-shaped mold on the sheet when the sheet is made into shape. After the plastic cools and solidifies, a hollow through hole is formed, thereby reducing the amount of plastic used and the weight of the product. To the role of thermal insulation. However, there is a problem in that, since the hollow part is a through hole communicating with the outside world, the through hole becomes a weak point for stress bearing of the plate. In addition, since the through-hole wall adjacent to the through-hole forms a heat conduction path, and it is very short, heat can be easily dissipated, which reduces its thermal insulation capability. For this reason, need a kind of new hollow plastic plate. Contents of the invention [0003] In order to solve the above problems, the...

AI Technical Summary

Problems solved by technology

However, the existing problem is that since the hollow part is a through hole communicating with the outside world, the through hole becomes the weak point of the stress bearing of the plate.

In addition, since the through-hole wall adjacent to the through-hole forms a heat conduction path, and it is very short, the heat can be easily dissipated, which reduces its ability of heat preservation and heat insulation

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