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Manufacturing method of thin floor

A manufacturing method and flooring technology, applied in the field of flooring manufacturing, can solve the problems such as the inconvenience of removing the sanding and grinding process, achieve the effect of thorough removal, and improve production efficiency and yield

Inactive Publication Date: 2020-04-10
韩贵花
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the sanding and grinding process, only by thoroughly cleaning the surface of the paper tape, can the defective floor be avoided. Due to the adhesive layer of the paper tape itself, the process of removing the paper tape will bring inconvenience to the sanding and grinding process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] A method of manufacturing a thin floor, comprising the steps of:

[0014] First, prepare the paper tape for splicing: mix the starch with water to become pasty starch, apply the pasty starch on the glue surface layer of the paper tape, then dry it to make the paper tape for splicing, and set it aside;

[0015] Secondly, splicing the thin floor: soak the glue surface layer of the spare splicing paper tape with warm water, and then bond the splicing between multiple pieces of solid wood veneer monomers, and use the splicing paper tape to splice the multiple pieces of solid wood veneer on Together, the thickness of the solid wood veneers to be spliced ​​is 0.5~2mm; the temperature of the warm water is 25°C~29°C;

[0016] Thirdly, the composite floor substrate: the other side of the multi-piece solid wood veneer spliced ​​by the above-mentioned paper tape is thermally bonded to the floor substrate;

[0017] Finally, remove the washi tape for splicing and sand the surface o...

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PUM

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Abstract

The invention discloses a manufacturing method of a thin floor. The manufacturing method comprises the following steps of preparing paper adhesive tape for splicing, specifically, the adhesive face ofthe paper adhesive tape is dot-coated with pasty starch, then drying is carried out, and the paper adhesive tape prepares to be used; splicing the thin floor, specifically, the adhesive face of the paper adhesive tape for splicing is wet with warm water, and then a plurality of solid wood veneers are bonded for splicing; compounding the veneers with a floor substrate, specifically, the other sides of the multiple solid wood veneers spliced through the paper adhesive tape are bonded with the floor substrate through hot pressing; and removing the paper adhesive tape for splicing, and sanding and grinding the surfaces of the solid wood veneers. By means of the manufacturing method of the thin floor, the paper adhesive take and leftovers thereof on the surface of the solid wood floor can be removed more easily and thoroughly, and thus the floor production efficiency and the yield are increased.

Description

technical field [0001] The invention relates to the field of floor manufacturing, in particular to a thin floor manufacturing method. Background technique [0002] A kind of manufacturing method of the existing thin floor, usually adopt paper tape to paste multiple pieces of solid wood veneer, and splicing, the other side of spliced ​​solid wood veneer and the floor substrate are glued with melamine to form a semi-finished floor to be sanded, The surface of the semi-finished floor must go through a sanding process, the purpose of which is to remove the paper tape left on the surface of the spliced ​​solid wood veneer, and at the same time make the surface smooth and smooth. In the sanding and grinding process, only by thoroughly cleaning the surface of the paper tape, can the defective floor be avoided. Due to the adhesive layer of the paper tape itself, the process of removing the paper tape will bring inconvenience to the sanding and grinding process. Contents of the inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27M3/04B27D3/00B27D5/00
CPCB27D3/00B27D5/00B27M3/04
Inventor 韩贵花崔震洙
Owner 韩贵花