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Multi-clip structure for die bonding
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A technology of bare chips and components, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as waste products and affecting device performance
Pending Publication Date: 2020-04-10
INFINEON TECH AUSTRIA AG
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Misalignment or misalignment of clips may affect the performance of the unit or may result in scrapped parts
Method used
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example 1
[0079] Example 1 is a multi-clip structure that includes a first clip for die bonding, a second clip for die bonding, and affixing to the first and second clips to hold the first and second clips together holding strap.
[0080] In Example 2, the subject matter of Example 1 can optionally include wherein the first clip is a load clip for a power die and the second clip is a sense clip for a power die or a grid clip.
[0081] In Example 3, the subject matter of Example 1 or 2 can optionally include a third clip for die bonding, wherein the retention strap is secured to the third clip.
[0082] In Example 4, the subject matter of Example 3 can optionally include wherein the first clip is a load clip for the power die, the second clip is a sense clip for the power die, and the third clip is a Gate clamp for power die.
[0083] In Example 5, the subject matter of any one of Examples 1 to 4 can optionally include wherein the first clip includes a lower surface having a die-bondi...
example 8
[0086] Example 8 is a semiconductor device package comprising a die carrier, a die mounted on the die carrier, a first clip bonded to a first electrode of the die, a first electrode or a second electrode bonded to the die A second clip of electrodes and a molding compound encapsulating the die, the first clip and the second clip, wherein the first clip and the second clip are cast-in-place and fully encapsulated by the molding compound.
[0087] In Example 9, the subject matter of Example 8 can optionally include a retention strap secured to the first clip and the second clip.
[0088] In Example 10, the subject matter of Example 8 or 9 may optionally include wherein the semiconductor devicepackage is a wireless package.
[0089] In Example 11, the subject matter of any one of Examples 8 to 10 can optionally include wherein the die is a power die, the first clip is a load clip for the power die, and the second clip is a load clip for the power die. Sensing clip for die or ga...
example 14
[0092] Example 14 is a method of attaching a multi-clip structure to a die, the method comprising: providing a clip comprising a first clip for die bonding, a second clip for die bonding, and a clip secured to the first clip and the second clip. two clips to hold the first clip and the second clip together; and place the multi-clip structure on top of the die as a component.
[0093]In Example 15, the subject matter of Example 14 can optionally include wherein the placing is done with one pick-and-place operation.
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Abstract
A multi-clip structure (100) includes a first clip (110) for die bonding and a second clip (120, 130) for die bonding. The multi-clip structure (100) further includes a retaining tape (150) fixed to the first clip (110) and to the second clip (120, 130) to hold the first clip (110) and the second clip (120, 130) together.
Description
technical field [0001] The present disclosure relates to the field of semiconductor device packaging, and more particularly to techniques for attaching clips to dies. Background technique [0002] Packaging a die in a semiconductor device typically requires connecting electrical terminals to the die. Wire bonding, ribbon bonding, and clip bonding are viable options for die bonding. Wire bonding and clip bonding are sometimes combined in one package in order to benefit from the distinguishing features of these technologies. While clip bonding allows for low electrical and thermal resistance, wire bonding is easy to automate and inexpensive to manufacture. [0003] Clip bonding requires precise placement of the clip on the die and alignment with the contacts to be connected. Misalignment or misalignment of clips may affect the performance of the unit or may result in scrapped parts. Contents of the invention [0004] A multiple clip configuration includes a first clip fo...
Claims
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