A kind of method that utilizes additive method to make circuit layer stepped copper thick copper-based circuit board

Abstract

The invention discloses a method for manufacturing a circuit layer stepped copper thickness copper-based circuit board by using an additive process, and relates to the technical field of circuit boardmanufacturing. A copper substrate comprises a copper base surface and a circuit surface, and the circuit surface is provided with a thick copper area. The manufacturing method comprises the followingsteps of realizing a first circuit, a solder mask, a second circuit, an electroplated pattern and a third circuit orderly. By utilizing the additive process, the pattern transfer is conducted on a semi-finished circuit board subjected to solder mask manufacturing, the position where thick copper needs to be manufactured is exposed, and then the circuit layer stepped copper thickness copper-basedcircuit board is manufactured through multiple times of pattern electroplating. According to the method, at the electroplating operation, the difference between the electroplating area of the circuitsurface and the electroplating area of the copper base surface does not exceed 5%, it can be ensured that the local thick copper of the circuit surface meets the requirements of customers (the copperthickness is larger than 140 microns) by conducting production according to a conventional device, meanwhile, the minimum line width of dense circuits of the copper thick circuit layer can reach 0.14mm, and a new device does not need to be additionally added.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing a circuit layer stepped copper-thick copper-based circuit board by an additive method. Background technique [0002] Metal-based printed circuit boards are often used in products with high power and high heat dissipation requirements due to their good heat dissipation capabilities (the thermal conductivity of metal copper is 400W / m.k). [0003] The circuit layer of conventional circuit boards requires uniform copper thickness, and the copper thickness difference is less than 5um. When the copper thickness of the circuit layer increases, the minimum line width & minimum line spacing of the circuit layer increase accordingly, and the two are in direct proportion; when the customer designs the circuit layer Locally thick copper (copper thickness difference > 100um), and the minimum line width & minimum line spacing of the circuit layer must...

AI Technical Summary

Problems solved by technology

[0003] The circuit layer of conventional circuit boards requires uniform copper thickness, and the copper thickness difference is less than 5um. When the copper thickness of the circuit layer increases, the minimum line width & minimum line spacing of the circuit layer increase accordingly, and the two are in direct proportion; when the customer designs the circuit layer Locally thick copper (copper thickness difference > 100um), and the minimum line width & minimum line spacing of the circuit layer must be relatively small, which cannot be achieved for the existing production process

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