Laminating process of super-thick multilayer board
A multi-layer board, ultra-thick technology, applied in the direction of multi-layer circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of scrapping, board deviation, and fewer layers of multi-layer circuit boards
Pending Publication Date: 2020-04-10
华宇华源电子科技(深圳)有限公司
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Problems solved by technology
[0004] The number of layers of existing multilayer circuit boards is still relatively small. When the required thickness is large, firstly, it may not meet the processing specifications of the lamination equipment, and it is difficult to position the equipment and make lamination difficult; secondly, when the thickness is large, Forcible pressing can easily cause the board to deviate, slide and even be scrapped
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0023] Press fit the sp175 type plate as shown in the table below:
[0024]
[0025] The board in the table is a 20-layer 8oz inner layer board. According to the laminate design, the total thickness before lamination reaches 12.15mm. 1. It is difficult for the riveting machine to position the plate.
[0026] The height of the PIN nails of the conventional fusion machine and riveting machine is 16mm. During the positioning process, it is necessary to reserve 8mm...
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The invention discloses a laminating process of a super-thick multilayer board. The laminating process comprises the following steps: dividing a board to be synthesized into a preset number of substrates; pressing the substrates into a daughter board by using a first board pressing process; and laminating the daughter board into a mother board by using a second board pressing process. The thicknesses of the daughter board and the mother board are within a preset range; the first plate pressing process comprises the steps of pp cutting, browning, fusion, riveting, X-RAY inspection, typesetting,hot pressing, cold pressing, plate disassembling, targeting and edge milling; and the second plate pressing process comprises the steps of pp cutting, browning, plate baking, fusion, riveting, X-RAYinspection, typesetting, hot pressing, cold pressing, plate disassembling, targeting and edge milling. When the multilayer board with large thickness is laminated, new pressing equipment is not needed, and the effects of board deviation and board sliding are not caused during pressing.
Description
technical field [0001] The invention relates to the field of PCB board processing technology, in particular to a lamination technology of ultra-thick multi-layer boards. Background technique [0002] Printed circuit board (PCB) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. After electronic equipment adopts PCB board, due to the consistency of similar printed boards, manual wiring errors are avoided, and functions such as automatic insertion or placement of electronic components, automatic soldering, and automatic detection can be realized to ensure the quality of electronic equipment. , Improve labor productivity, reduce costs, and facilitate maintenance. [0003] In order to meet the needs of high-performance electronic equipment, ultra-thick multilayer boards have emerged. High-performance multilayer boards have more advanced electrical properties and better mechanical stabilit...
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IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 高团芬王金平仵中印
Owner 华宇华源电子科技(深圳)有限公司