Grabbing and conveying device for wafer biscuit slice cooling machine

Abstract

The invention discloses a grabbing and conveying device for a wafer biscuit slice cooling machine. The grabbing and conveying device includes a machine frame; an upper supporting frame is fixed to thetop face of the middle of a top plate of the rack. Rail strips are fixed to the left side and the right side of the top face of the rear portion of the top plate of the rack. Two rail sliding blocksare arranged on the rail strips. A horizontal plate is fixed on the top surfaces of the two rail sliding blocks; a moving block is fixed in the middle of the bottom surface of the horizontal plate; connecting plates are fixed to the middle portion and the rear portion of the top face of the top plate of the rack. The two ends of a moving screw are hinged to the two connecting plates through bearings; a main moving motor is fixed to the rear wall face of the connecting plate at the rear part, an output shaft of the main moving motor is a spline shaft, the spline shaft is inserted into a splinehole formed in the rear end of the moving screw in a sleeved mode; the moving block is connected into the moving screw in a screwed mode, and a grabbing plate is hinged to the top face of the horizontal plate through a hinge shaft. According to the grabbing and conveying device, biscuit slices can be automatically taken and placed, great convenience is achieved, adsorption is uniform during grabbing, and chipping of the biscuit slices is reduced.

Description

Technical field: [0001] The invention relates to the technical field of food processing equipment, and more specifically relates to a grasping and conveying device for a wafer biscuit cooling machine. Background technique: [0002] The existing wafer biscuit production process includes batter stirring, pie baking, pie cooling, pie coating, pie cooling, and cutting. The pie cooling is an important process, which requires the heated pie Or the pie slices coated with cream coating are cooled. The existing cooling method is to directly place the pie slices on the cooling platform and cool them naturally. It needs to be placed and taken manually, which is very troublesome, and the follow-up of the pie slices It is very troublesome and inefficient to place and take the cake slices manually in each link, and manual picking and placement will easily cause a large amount of chipping of the cake slices. Invention content: [0003] The purpose of the present invention is to overcome...

AI Technical Summary

Problems solved by technology

[0002] The existing wafer biscuit production process includes batter stirring, pie baking, pie cooling, pie coating, pie cooling, and cutting. The pie cooling is an important process, which requires the heated pie Or the pie slices coated with cream coating are cooled. The existing cooling method is to directly place the pie slices on the cooling table and cool them naturally. It needs to be placed and taken manually, which is very troublesome, and the follow-up of the pie slices It is very troublesome and inefficient to place and take the cake slices manually in each link, and it is easy to cause a lot of chipping when picking and placing the cake manually

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