Gold melting hanging plate operation method
A hanging board and pooling technology, applied in the field of warehousing, can solve the problems of time-wasting, gold-dipping, and complicated bead stringing, etc., and achieve the effect of preventing cost waste, reducing damage, and saving process flow.
Inactive Publication Date: 2020-04-17
AOSHIKANG TECH CO LTD
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Problems solved by technology
[0003] 1. During the process of beading, the copper wire is easy to scratch the board next to the beading;
[0004] 2. After using copper wire beads, the gold will be brought out during the chemical immersion gold process, resulting in cost waste;
[0005] 3. The beading is complicated and requires at least 3 points of fixation, which is a waste of time for wearing the board
Method used
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Embodiment 1
[0026] like figure 1 A kind of gold hanging board operation method shown, comprises following method, PCB board is fixed on the gold hanging board structure; Described gold hanging board structure comprises two U-shaped boards 1 that are a group, U-shaped board 1 is detachably connected with a threading rod 2, a hook 3 is fixed on the U-shaped plate 1, a fixing bolt 4 is threaded on the hook 3, and a rotating butterfly plate 5 is fixed on the threading rod 2; the U-shaped plate 1 passes through a connecting plate 6 are fixed to each other; the hanging hole on the PCB board and the penetrating rod 2; the two ends of the PCB board are punched with a hanging plate hole, when the gold is melted, first rotate the penetrating rod 2 by rotating the butterfly plate 5 to make one end leave the U-shaped board 1 , and then pass the rod 2 through the hole of the hanging board to fix the PCB board, fix it on the transportation device through the hook 3, and transport it to the Huajin Pool ...
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The invention discloses a gold melting hanging plate operation method. The method comprises the following steps that during gold melting, a butterfly piece is rotated to rotate a penetrating rod to enable one end of the penetrating rod to leave a U-shaped plate, then the penetrating rod penetrates through plate hanging holes to fix a PCB, the plate is fixed to a conveying device through a hook, isconveyed to a gold melting pool for gold melting, then a gold melting hanging plate structure is taken out for standing, and the PCB is taken down after preset time is up. According to the invention,only two board hanging holes need to be punched in the PCB, so that the damage to the PCB is reduced, and the technological process is saved; the fixation is achieved through the elastic sheet, so that the hook is prevented from accidentally falling off when being fixed on the conveying device; and a Teflon layer is applied for coating, so that the cost waste caused by gold staining and taking-out is effectively prevented.
Description
technical field [0001] The invention belongs to the field of warehousing, and in particular relates to an operation method of chemical gold hanging boards. Background technique [0002] The chemical immersion nickel gold process in the PCB stage traditionally uses copper wire beading operation technology; the disadvantages of using copper wire beading technology: [0003] 1. During the process of beading, the copper wire is easy to scratch the board next to the beading; [0004] 2. After using copper wire beads, the gold will be brought out during the chemical immersion gold process, resulting in cost waste; [0005] 3. The beading is complicated and requires at least 3 points of fixation, which wastes time when wearing the board. Contents of the invention [0006] The object of the present invention is to provide a kind of method of chemical gold hanging plate operation, the present invention only needs to punch two hanging plate holes on the PCB board, has reduced the ...
Claims
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IPC IPC(8): H05K3/18
CPCH05K3/18H05K2203/1518
Inventor 周金罗应点
Owner AOSHIKANG TECH CO LTD