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Heat dissipation device and electronic equipment

A technology of heat dissipation device and electronic equipment, applied in the field of communication, can solve problems such as poor heat dissipation effect of heat pipe

Inactive Publication Date: 2020-04-17
维沃移动通信(重庆)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problem of poor heat dissipation effect of the heat pipe in the existing electronic equipment, the embodiment of the present invention proposes a heat dissipation device and an electronic equipment

Method used

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  • Heat dissipation device and electronic equipment
  • Heat dissipation device and electronic equipment
  • Heat dissipation device and electronic equipment

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Embodiment Construction

[0016] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0017] refer to figure 1 , showing a schematic structural view of a heat sink of the present invention, referring to figure 2 ,show figure 1 The schematic cross-sectional structure of the heat dissipation device, the heat dissipation device may specifically include: a magnetically controlled cooling element 10, an electromagnetic element 11, and at least one heat conducting element 12; wherein, the magnetically controlled cooling element 10 may include a flexible film 101 and be packaged in a flexible The magnetic refrigeration working medium 102 in the film 101; the heat conduction element 12 is connected to the side of the magnetically controlled cooling element 10; the electromagnetic element 11 is connected to the front of t...

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Abstract

The embodiment of the invention provides a heat dissipation device and electronic equipment. The heat dissipation device specifically comprises a magnetic control refrigerating member, an electromagnetic member and a plurality of heat conduction members, wherein the magnetic control refrigerating member comprises a flexible film and a magnetic refrigeration working medium packaged in the flexiblefilm, the heat conduction members are connected with the magnetic control refrigerating member, the electromagnetic member is connected with the magnetic control refrigerating member, the magnetic control refrigerating member is heated when the electromagnetic member is powered on, and the magnetic control refrigerating member is cooled when the electromagnetic member is powered off. In the embodiment of the invention, the heat dissipation efficiency of the heat dissipation device is high, so that the temperature of the electronic element can be reduced.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a heat dissipation device and an electronic device. Background technique [0002] As electronic devices such as mobile phones and tablet computers play an increasingly important role in users' lives, the performance of electronic devices is improving faster and faster, and users use electronic devices more and more frequently every day. Correspondingly, the heating phenomenon of the electronic components in the electronic equipment is becoming more and more serious. [0003] In the prior art, in order to conduct heat from electronic components to the outside of the mobile terminal, heat pipes are often used to conduct heat from the hot end to the cold end (other places on the electronic device that do not generate heat). [0004] However, when heat pipes are used to dissipate heat from electronic devices, the heat pipes can only simply export the heat and electricity gener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F25B21/00
CPCF25B21/00H05K7/20H05K7/2039Y02B30/00
Inventor 刘钦雷
Owner 维沃移动通信(重庆)有限公司
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