Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor equipment scheduling method, scheduling device and system

A scheduling method and a scheduling device technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of blocking risk of multiple tasks scheduled by the scheduling device, and achieve the effect of reducing the risk of blocking and reducing the amount of calculation

Active Publication Date: 2022-04-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention at least partially solves the problem that the existing scheduling device of semiconductor equipment has the risk of blocking when scheduling multiple tasks, and provides a scheduling method for semiconductor equipment, a scheduling device for semiconductor equipment, and a semiconductor equipment system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor equipment scheduling method, scheduling device and system
  • Semiconductor equipment scheduling method, scheduling device and system
  • Semiconductor equipment scheduling method, scheduling device and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a scheduling method for semiconductor equipment. The semiconductor equipment includes multiple functional modules. The scheduling method is used to schedule multiple tasks, wherein each task is used to take at least one wafer w out of the wafer box and sequentially transfer it to the Many of the functional modules are then transmitted into the crystal box.

[0036] The functional module is, for example, a pre-evacuated chamber or a process chamber for processing the wafer w such as deposition and etching.

[0037] The semiconductor equipment is used to perform a plurality of tasks, each task is used to process at least one wafer w. One of the tasks, for example, is to sequentially take out a wafer w from the second crystal box LP2, then transfer it to the first pre-evacuation chamber LA, and then transfer it to the first process chamber CH1 and the third process chamber CH3 in sequence. . The fifth process chamber CH5 is then transferred into t...

Embodiment 2

[0067] This embodiment provides a semiconductor device scheduling device for executing the method provided in Embodiment 1. The semiconductor equipment includes a plurality of functional modules, and the scheduling device is used to schedule a plurality of tasks, wherein each task is used to take at least one wafer out of the crystal box and sequentially transfer it to a plurality of the functional modules and then transfer it into the wafer box. Such as Figure 5 As shown, the scheduling device includes:

[0068] The first acquisition module 1 is used to acquire the first status information of the last wafer transmitted to the first functional module in the previous task, and send the first status information to the second acquisition module;

[0069] The second acquisition module 2 is used to acquire the distribution status of the wafers in the functional modules involved in the previous task when the first status information is received;

[0070] The judging module 3 is u...

Embodiment 3

[0076] This embodiment provides a semiconductor device system, including the semiconductor device scheduling device provided in Embodiment 2 of the present invention, and also includes the semiconductor device, the semiconductor device includes multiple functional modules, and the scheduling device is used to schedule multiple tasks, each of which The task is to take at least one wafer out of the crystal box and sequentially transfer it to multiple functional modules and then transfer it into the crystal box.

[0077]Optionally, the functional modules include a pre-evacuation chamber and a process chamber, and each task is used to take at least one wafer out of the wafer box and sequentially transfer to multiple functional modules among them, and then transfer the wafer into the wafer box including: Each task is used to take at least one wafer out of the wafer box and sequentially transfer to the pre-evacuation chamber, at least one process chamber, the pre-evacuation chamber, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor equipment scheduling method, scheduling device and system, belonging to the technical field of semiconductor equipment, which can at least partly solve the problem of failure in calculation of wafer transmission action sequences in existing semiconductor equipment. The scheduling method of the present invention includes: when the last wafer in the previous task is transferred to the first functional module, obtaining the distribution status of the wafers in each of the functional modules involved in the previous task; Whether the distribution state of the wafers in the module complies with the auxiliary detection condition parameter table, wherein the distribution state of the wafers in each of the functional modules involved in the stable transmission of the previous task is stipulated in the auxiliary detection condition parameter table; if the previous task If the distribution state of the wafers in the related functional modules is consistent with the auxiliary detection condition parameter table, the calculation of the transport action sequence of the first wafer in the latter task is started.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to a scheduling method for semiconductor equipment, a scheduling device for semiconductor equipment, and a semiconductor equipment system. Background technique [0002] figure 1 Shown in is an existing semiconductor device, and its workflow is as follows: [0003] The atmospheric manipulator ATR takes out a wafer w from the crystal box (one of the first crystal box LP1, the second crystal box LP2, and the third crystal box LP3) and transfers it to a pre-evacuated chamber (also called a LoadLock chamber, namely figure 1 In the first pre-evacuation chamber LA or the second pre-evacuation chamber LB). Afterwards, the vacuum manipulator VTR (with a first arm A and a second arm B) located in the vacuum transfer chamber TC takes the wafer w out of the pre-evacuation chamber and sequentially transports it to a plurality of process chambers according to the pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67155
Inventor 雷花纪红
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD