Apparatus for measuring temperature of substrate and the method thereof

A temperature measurement and substrate technology, applied in measuring devices, measuring heat, thermometers, etc., can solve the problems of process yield reduction, difficulty in adjusting the process environment and ensuring yield, time waste, etc., to reduce the incidence of defects and alleviate the impact , the effect of increasing the yield

Active Publication Date: 2020-05-01
SUBARU TECNICA INTERNATIONAL
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0009] Therefore, it is difficult to accurately obtain the temperature of the target substrate in real time in the reflow process, thereby adjusting the process environment and ensuring the yield.
[0010] In addition, it is necessary to periodically prepare the substrate for temperature measurement and measure the temperature, which may lead to unnecessary waste of time and decrease in process yield.

Method used

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  • Apparatus for measuring temperature of substrate and the method thereof
  • Apparatus for measuring temperature of substrate and the method thereof
  • Apparatus for measuring temperature of substrate and the method thereof

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Embodiment Construction

[0059] Hereinafter, the structure and function of the substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[0060] Here, the description of the contents described in the prior art and the overlapping contents will be omitted, and the description will focus on the newly added components in the present invention.

[0061] The first embodiment of the substrate temperature measuring device 200 according to the present invention will be described.

[0062] like figure 1 As shown, the substrate temperature measuring device 200 according to the present invention includes a probe 220, and is equipped to penetrate up and down the substrate support part 110 that supports the substrate W and performs the substrate processing process, and the upper end 210 of the substrate temperature measuring device 200 is lifted from the substrate support part. The upper surface of the probe 110 protrudes, wherein t...

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PUM

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Abstract

The present invention relates to a substrate temperature measuring device and a substrate temperature measuring method and, more specifically, to a substrate temperature measuring device and a substrate temperature measuring method, which can measure the temperature of a substrate in a substrate processing process in real time. To this end, according to the present invention, the substrate temperature measuring device includes a probe which vertically penetrates a substrate support for supporting the substrate to perform the substrate processing process, and which has an upper end protruding from an upper surface of the substrate support. The upper end of the probe is formed to measure the temperature by being in contact with a lower side of the substrate.

Description

technical field [0001] The invention relates to a substrate temperature measuring device and a substrate temperature measuring method, in particular to a substrate temperature measuring device and a substrate temperature measuring method which can measure the temperature of a substrate in a substrate processing process in real time. Background technique [0002] Today, semiconductor packaging technology is being applied as a method for realizing larger capacity and higher performance of semiconductor products. [0003] In such a semiconductor packaging process, a process of forming bumping balls that electrically connect a semiconductor-mounted substrate or different semiconductors is called a reflow process. [0004] Generally, the substrate used in the reflow process is made of silica gel (Si). [0005] The reflow process is configured to heat the substrate to temporarily satisfy the high temperature state of the substrate, and the reflow process is performed in the high ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/14G01K1/02H01L21/67H01L21/66
CPCG01K1/024G01K1/143G01K1/146H01L21/67248H01L22/12G01K1/08G01K1/16G01K13/00H01L23/34
Inventor 朴永秀孙侐主朴商弼柳守烈金永镐金学杜
Owner SUBARU TECNICA INTERNATIONAL
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