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Packaging substrate and manufacturing method thereof

A technology for packaging substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as poor heat dissipation and difficulty in laser opening, and achieve improved laser production capacity and heat dissipation high efficiency effect

Active Publication Date: 2021-10-19
礼鼎半导体科技秦皇岛有限公司 +1
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Problems solved by technology

However, the heat dissipation effect of this heat dissipation method is not good, and laser opening is difficult

Method used

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  • Packaging substrate and manufacturing method thereof
  • Packaging substrate and manufacturing method thereof
  • Packaging substrate and manufacturing method thereof

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Embodiment Construction

[0027] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-8 And the preferred implementation mode, the specific implementation mode, structure, features and effects of the packaging substrate and its manufacturing method provided by the present invention are described in detail as follows.

[0028] see Figure 1-8 , a preferred embodiment of the present invention provides a method for manufacturing a packaging substrate 100, including the following steps:

[0029] For a first step, see figure 1 , providing a carrier substrate 10 , the carrier substrate 10 includes a carrier plate 11 and a seed layer 12 formed on the carrier plate 11 .

[0030] The material of the carrying board 11 is any kind of insulating material with carrying function. In this embodiment, the carrier board 11 is made of polyimide (PI). In other embodiments...

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Abstract

A method for manufacturing a packaging substrate, comprising the steps of: raising a carrying substrate, the carrying substrate includes a carrying plate and a seed layer formed on the carrying plate; forming a first conductive circuit on the surface of the seed layer layer; providing a dielectric layer and laminating the dielectric layer from the first conductive circuit layer; opening at least one heat dissipation hole on the dielectric layer through a laser process; forming a thermal hole on the dielectric layer through an electroplating process The second conductive circuit layer, the second conductive circuit layer is filled in the heat dissipation hole to form a heat dissipation pad, the heat dissipation pad is electrically connected to the first conductive circuit layer and the second conductive circuit layer, and the diameter of the heat dissipation pad is 100um~1000um; and removing the bearing plate. The invention also relates to a packaging substrate.

Description

technical field [0001] The invention relates to a packaging substrate and a manufacturing method thereof. Background technique [0002] Electronic components are generally attached to the package substrate, and when the electronic components are working, they will generate heat, thereby generating heat. In the prior art, small-diameter heat dissipation holes are used for heat dissipation. However, the heat dissipation effect of this heat dissipation method is not good, and laser opening is difficult. Contents of the invention [0003] In view of this, the present invention provides a packaging substrate with good heat dissipation effect and easy laser opening and a manufacturing method thereof. [0004] A method for manufacturing a packaging substrate, comprising the steps of: raising a carrying substrate, the carrying substrate includes a carrying plate and a seed layer formed on the carrying plate; forming a first conductive circuit on the surface of the seed layer la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/12H01L23/367H01L23/498
CPCH01L23/12H01L23/498H01L23/367H01L23/3677H01L24/43
Inventor 黄士辅陈贻和黄昱程
Owner 礼鼎半导体科技秦皇岛有限公司
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