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Edge defect inspection method

An inspection method and edge defect technology, applied in the field of inspection, can solve problems such as undetected cracks in protective structures, distortion of grain edge search, collapse of protective structures or undetected cracks, etc.

Active Publication Date: 2022-07-12
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the difference in the gray scale value of the image depends on the adjustment of the light source, the light source decay period and the reflection degree of the product surface, these uncertain factors can easily cause the search distortion of the grain edge
In the case where the grain edge has been distorted, when judging from the grain edge with a fixed grain chipping parameter specification, it may happen that the chipping or crack that actually damaged the protective structure is not detected
In addition, when the wafer cutting is offset, the distance from the four sides of the die to the protection structure will be different. Checking in the above-mentioned way, it may happen that the protection structure has actually been damaged on one or some sides. Structural breakage or cracks are not detected

Method used

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Embodiment Construction

[0036] figure 1 It is a flow chart of steps of an edge defect inspection method according to an embodiment of the present invention. figure 2 It is a schematic diagram of cutting out a target element in an embodiment of the present invention. Please refer to figure 1 and figure 2 . The present embodiment provides an edge defect inspection method, and the edge defect inspection method is suitable for inspecting a target device 100, such as a die or a wafer-level chip package separated by wafer dicing. In this embodiment, the target element 100 is a wafer-level chip package cut out from a wafer 90 by the cutting equipment 80 , such as figure 2 shown, but the invention is not so limited.

[0037] image 3 It is a schematic diagram of acquiring the appearance of a target element in an embodiment of the present invention. 4A to 4D It is a top view of an edge defect inspection method of a target component in an embodiment of the present invention. Please also refer to f...

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Abstract

The present invention provides an edge defect inspection method, comprising the following steps: obtaining an appearance of a target component to obtain an appearance image; determining a plurality of reference points according to the appearance image; forming an identification pattern according to the reference points; and according to the identification pattern and appearance The image produces an inspection result.

Description

technical field [0001] The present invention relates to an inspection method, and in particular, to an edge defect inspection method. Background technique [0002] In the semiconductor industry, after a wafer is fabricated into an integrated circuit, chip packaging is required to prevent the integrated circuit from being polluted by the outside world, and to form an electrical connection path between the chip and the electronic system. There are two commonly used chip packaging methods: one is to first cut the processed wafer into multiple dies, and then carry out subsequent packaging and manufacturing; the other is wafer-level packaging, that is, packaging directly on the entire chip After fabrication, the wafer is diced to form a plurality of individual chip packages. However, regardless of the singulated die or the wafer-level chip package, edge defects such as chipping or cracks may be generated at the edge of the die / chip after dicing. Therefore, it is necessary to se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/12H01L22/20
Inventor 杨丰瑞张哲恺李忠儒林振斌林尚德刘宗祐
Owner CHIPMOS TECH INC
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