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Heat dissipation chip and manufacturing method thereof and electronic equipment

A manufacturing method and heat sink technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of lack of reinforcement support for the shell structure, deformation of the shell, and reduced stability of chips, so as to avoid deformation and improve The effect of service life and preventing damage from excessive temperature

Active Publication Date: 2020-05-05
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And when making the shell of the chip, because the shell structure cannot be reinforced and supported, it is easy to cause the shell to deform and reduce the stability of the chip.

Method used

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  • Heat dissipation chip and manufacturing method thereof and electronic equipment
  • Heat dissipation chip and manufacturing method thereof and electronic equipment
  • Heat dissipation chip and manufacturing method thereof and electronic equipment

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Embodiment Construction

[0056] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0057] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0058] In addition, the ...

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PUM

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Abstract

The invention discloses a heat dissipation chip and a manufacturing method thereof and electronic equipment. The heat dissipation chip comprises a substrate; a chip module which comprises a chip and aradiator, wherein the chip and the radiator are arranged on the same side of the substrate and are adjacent to each other to allow the radiator to dissipate heat of the chip; and a housing which is arranged on the side, deviating from the substrate, of the chip module, covers the chip module, and abuts against the radiator. According to the technical scheme, good heat dissipation is provided forthe chip, the chip is prevented from being damaged due to too high temperature, the service life of the chip is prolonged, it is guaranteed that the housing structure is supported, and the use stability of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation chip, a manufacturing method thereof, and electronic equipment. Background technique [0002] In the exemplary technology, on the SIP packaging module [SIP packaging (System In a Package) is to integrate multiple functional chips, including functional chips such as processors and memories, into one package, thereby realizing a basically complete package. function], the highly integrated SIP module will generate a lot of heat when it is working. If effective measures are not taken in time to take away the heat generated, the functional chip in the SIP package module will be damaged soon or fail to meet expectations. service life. And when making the shell of the chip, since the shell structure cannot be reinforced and supported, it is easy to cause deformation of the shell and reduce the use stability of the chip. [0003] The above is only used to as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/04
CPCH01L23/04H01L23/3672H01L23/3675
Inventor 王德信王文涛方华斌
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD