A kind of flash corrosion potion and its preparation method and application

A flash corrosion and potion technology, which is applied in chemical instruments and methods, removal of conductive materials by chemical/electrolytic methods, and printed circuit manufacturing. Problems such as side etching phenomenon occur, to maintain the rectangular shape, reduce etching, and protect the edges and corners

Active Publication Date: 2021-06-22
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the common etching potion on the market has a strong side erosion effect on the copper surface after graphic plating, and the solution is more likely to attack the side wall of the circuit, which is very prone to side erosion, and it is difficult to achieve the effect of only etching the bottom copper; at the same time , the edges and corners of the line are bitten by the potion in two directions, and the rectangular shape of the line section cannot be maintained
[0004] CN102296293A discloses a micro-etching agent for printed circuit boards, including a potassium persulfate compound, a stabilizer, a persulfate and a sulfuric acid system, or a potassium persulfate compound, a stabilizer, a persulfate and a phosphoric acid system; The microetch provided by the patent application has a better biting surface, but does not consider the influence of side etching on the circuit
This patent application uses air atomization technology to achieve the purpose of correcting the amount of side erosion, and the preparation method is relatively complicated

Method used

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  • A kind of flash corrosion potion and its preparation method and application
  • A kind of flash corrosion potion and its preparation method and application
  • A kind of flash corrosion potion and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0040] A flash corrosion potion with a volume of 1L, including the following components dissolved in deionized water:

[0041]

[0042] The preparation method is as follows:

[0043] (1) 0.3L deionized water, sulfuric acid solution (50%) and hydrogen peroxide solution (50%) are mixed;

[0044] (2) The mixed solution obtained in step (1), 1,2-propanediol, n-propanol, lactic acid and acetic acid are mixed;

[0045] (3) Mix and react the pure copper foil (purchased from Kunshan Luzhifa Electronic Technology Co., Ltd.) with the mixed solution obtained in step (2) three times, and control the reaction temperature to 30°C. After the pure copper foil is completely dissolved, Transfer the mixed solution to a volumetric flask, and wash the reaction vessel three times with deionized water. The cleaning solution is also transferred to a volumetric flask, and finally the volume is adjusted to 1 L with deionized water to obtain a flash corrosion solution.

Embodiment 2-3

[0047] The difference from Example 1 is that in this example, 20g of 1,2-propanediol and 5g of n-propanol (Example 2), 5g of 1,2-Propanediol and 15g of n-propanol (Example 3) are included.

Embodiment 4

[0049] The difference from Example 1 is that in this example, n-propanol is replaced by isopropanol of equal mass.

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Abstract

The invention provides a flash corrosion potion and its preparation method and application. The flash corrosion potion includes the following components dissolved in deionized water: sulfuric acid 50-100g / L; hydrogen peroxide 10-50g / L; copper ions 5-45g / L; mixed alcohol 10-35g / L; balance is deionized water; wherein, the mixed alcohol is a combination of any two alcohols. The flash corrosion potion provided by the present invention can effectively remove the bottom copper and reduce side corrosion, and at the same time effectively protect the edges and corners of the circuit, maintain the rectangular shape of the circuit cross section, and be applicable to the MSAP process; at the same time, the flash corrosion potion provided by the present invention has Good storage stability.

Description

technical field [0001] The invention belongs to the technical field of etching solution, and relates to a flash etching potion and its preparation method and application, in particular to a flash etching potion for MSAP process and its preparation method and application. Background technique [0002] With the rapid development of electronic devices represented by smart phones and tablet computers, electronic products are becoming more and more comprehensive in function and smaller in size, so the requirements for printed circuit boards (PCB) are getting higher and higher, and Driving the PCB industry to develop in the direction of high density, high integration, packaging, miniaturization and multi-layering, the requirements for the refinement level of PCB product lines are also getting higher and higher. At present, the line width and spacing above 75μm / 75μm have already It cannot meet the development requirements of today's electronic products. The line width and line spac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K13/06H05K3/06
CPCC09K13/06H05K3/067
Inventor 刘江波李晓红王亚君
Owner 上海天承化学有限公司
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