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Circuit board and electroplating method thereof

A technology for circuit boards and electroplating areas, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of damage to the circuit board 100a circuit and electronic components, and the inability to coat the electroplating solution, so as to avoid air bubbles and improve manufacturing quality. rate effect

Inactive Publication Date: 2020-05-12
BOARDTEK ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, after the circuit board 100a is used for a long time or undergoes repeated thermal expansion and contraction, the electroplating body 2a often cannot cover the electroplating solution 300a in the gap 200a, and then the electroplating solution 300a flows out and damages the circuit on the circuit board 100a. electronic components

Method used

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  • Circuit board and electroplating method thereof
  • Circuit board and electroplating method thereof
  • Circuit board and electroplating method thereof

Examples

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Embodiment 1

[0030] Such as Figure 2 to Figure 8 As shown, it is Embodiment 1 of the present invention. This embodiment discloses a circuit board and its electroplating method, and the circuit board is limited to be made by the electroplating method of the circuit board in this embodiment. Accordingly, the electroplating method of the circuit board of this embodiment will be described below.

[0031] The electroplating method for the circuit board includes steps 1 to 5, and each step in steps 1 to 5 will be described below. However, each step in the above step 1 to step 5 can be adjusted and changed according to design requirements, and is not limited to what is described in this embodiment.

[0032] Step 1: If figure 2 with image 3 As shown, a substrate 1 is provided, and the substrate 1 includes a first board surface 121 and a second board surface 131 on opposite sides. Wherein, the substrate 1 includes an insulating plate body 11 in this embodiment, a top conductive layer 12 dis...

Embodiment 2

[0044] Such as Figure 9 to Figure 11 As shown, it is Embodiment 2 of the present invention. This embodiment is similar to the above-mentioned Embodiment 1, so the similarities between the two embodiments will not be repeated (such as: step 1 and step 2), and this embodiment is the same as The differences in Embodiment 1 are roughly described as follows:

[0045] Step 3: If Figure 9 As shown, the electroplating carrier 200 is attached to the second surface 131 of the substrate 1 in a detachable manner with an adhesive layer 400 to cover the through hole H of the insulating plate body 11 . Wherein, the electroplating carrier 200 in this embodiment may be a metal plate (such as a stainless steel plate) or an additional circuit board coated with a conductive film, but the present invention is not limited thereto. That is to say, the electroplating carrier 200 can only have a conductive function in the electroplating area 201 , while other parts can be made of insulating materi...

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Abstract

The invention discloses a circuit board and an electroplating method thereof. The electroplating method of the circuit board comprises the steps: 1, providing a base plate, wherein the base plate comprises a first plate surface and a second plate surface located at opposite sides; 2, forming a through hole penetrating through the first plate surface and the second plate surface in the base plate;3, attaching an electroplating carrier to the second plate surface of the base plate in a tearable manner so as to shield the through hole, wherein the electroplating carrier part for shielding the through hole is defined as an electroplating area; 4, forming a metal column body for filling the through hole from the electroplating area of the electroplating carrier in an electroplating mode; and 5, tearing off the electroplating carrier from the base plate and the metal column body. According to the invention, the metal column body positioned in the through hole is formed by electroplating thetearable electroplating carrier, so that bubbles are effectively prevented from existing in the through hole of the base plate so as to improve the manufacturing yield of the circuit board.

Description

technical field [0001] The invention relates to a manufacturing method of a circuit board, in particular to a circuit board using a tear-off electroplating carrier and its electroplating method. Background technique [0002] see figure 1 As shown, it discloses a conventional circuit board 100a, which includes a board 1a and an electroplating body 2a. The board 1a has a through hole 11a, and the electroplating body 2a is formed in the through hole 11a to provide heat dissipation. However, when it is intended to perform electroplating in the through-hole 11a of the plate 1a to fill the through-hole 11a, the electroplating body 2a often forms a void 200a, and the highly corrosive electroplating solution 300a remains in the void 200a. At this time, after the circuit board 100a is used for a long time or undergoes repeated thermal expansion and contraction, the electroplating body 2a often cannot cover the electroplating solution 300a in the gap 200a, and then the electroplatin...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/423
Inventor 李建成
Owner BOARDTEK ELECTRONICS CORP