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Intelligent socket product hardware reliability test method and test system

A technology of smart socket and test system, which is applied in the field of testing to achieve the effect of reducing manual participation and improving test efficiency

Inactive Publication Date: 2020-06-02
SHENZHEN JIXIANG TENGDA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to propose a test method and test system for the reliability of the hardware of smart socket products, so as to solve the technical problems mentioned in the background technology

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  • Intelligent socket product hardware reliability test method and test system
  • Intelligent socket product hardware reliability test method and test system

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Embodiment Construction

[0026] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] It should be noted that relative terms such as "first", "second" and so on may be used to describe various components, but these terms do not limit the components. These terms are only used to distinguish one component from another. For example, without departing from the scope of the present invention, a first component may be called a second component, and a second component may similarly be called a first component. The term "and / or" refers to any one or more combination of related items and described items.

[0028] Such as figure 1 , figure 2 as shown, figure 1 It is a functional block diagram of a test system for the hardware reliability of the intelligent socket product of the present invention; figure 2 It is a schematic flow chart of the first embodiment of the test method for the hardware relia...

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Abstract

The invention discloses an intelligent socket product hardware reliability test method and test system. The system comprises a intelligent socket product to be tested, a frequency modulation power supply, a constant temperature and humidity box, a load resistor, a wireless router and a cloud management platform. The frequency modulation power supply is connected with the input end of the intelligent socket product to be tested, the intelligent socket product to be tested is arranged in the constant temperature and humidity box, the load resistor is connected with the output end of the intelligent socket product to be tested, the intelligent socket product to be tested is connected to the wireless router through WIFI, and the cloud management platform sends a control command to the intelligent socket product to be tested. According to the invention, the test can be carried out in various temperature and humidity environments, the test is more comprehensive, and the efficiency is higher.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a testing method for hardware reliability of intelligent socket products. Background technique [0002] At present, the application of smart home products in ordinary households is becoming more and more popular. Among them, smart socket products are the most basic type of products, and the supported current is fixed at 10A or 16A. The most critical component of the smart socket product is the relay. When the smart socket works for a long time, the relay is more likely to fail due to the influence of temperature, and cannot respond to the switch command, making the product unusable. Therefore, it is necessary to test the reliability of smart socket products working at full load for a long time. [0003] The existing test method is to connect multiple household appliances to the smart socket, try to make the smart socket reach the full working state, and then manually...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00
CPCG01R31/003
Inventor 张莉唐路俊
Owner SHENZHEN JIXIANG TENGDA TECH