Semiconductor memory device and method of operating semiconductor memory device

Abstract

A semiconductor memory device includes a plurality of memory bank groups configured to be accessed in parallel; an internal memory bus configured to receive external data from outside the plurality ofmemory bank groups; and a first computation circuit configured to receive internal data from a first memory bank group of the plurality of memory bank groups, during a period of reception of the internal data from the first memory bank group, receive successively a first external data and a second external data through the internal memory bus and in said period, perform successively a processingin memory, hereinafter termed PIM, arithmetic operation on the internal data and the first external data and the PIM arithmetic operation on the internal data and the second external data.

Description

[0001] Cross references to related applications [0002] This application claims the rights and interests of Korean Patent Application No. 10-2018-0153725 filed at the Korean Intellectual Property Office on December 3, 2018, the entire disclosure of which is incorporated herein by reference. Technical field [0003] The present application relates to a semiconductor memory device using processing in memory (PIM) and a method of operating the semiconductor memory device. Background technique [0004] The semiconductor memory device according to the related art has a function completely separated from a processor that performs arithmetic operations. Therefore, in a system that implements applications such as neural networks, big data, and the Internet of Things (IoT) that must process a large amount of data, a large amount of data is sent and received between the semiconductor memory device and the processor, and therefore, Bottlenecks occur frequently. In order to solve this proble...

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Problems solved by technology

Therefore, in a system implementing applications such as neural networks, big data, and the Internet of Things (IoT) that must handle large amounts of data, large amounts of data are transmitted and received between the semiconductor memory device and the processor, and thus will be frequent bottlenecks

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