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Chip packaging device

A technology of chip packaging and equipment, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of high risk of chip crushing, achieve the effect of improving the yield rate and facilitating disassembly and assembly

Inactive Publication Date: 2020-06-26
湖州靖源信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing packaging equipment is easy to make the chip into a small amount of dust, and it also requires manpower. During the packaging process, the risk of crushing the chip is relatively high

Method used

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-3, the present invention provides a technical solution: a chip packaging equipment, including a bottom box 1, the bottom of the bottom box 1 is provided with supporting feet, four supporting feet are provided at the bottom of the bottom box 1, and the four supporting feet are respectively fixedly connected to The four corners of the bottom of the bottom box 1 and the four supporting feet are all insulating materials. The bottom box 1 and t...

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Abstract

The invention discloses a chip packaging device. The chip packaging device comprises a bottom box, supporting legs are arranged under the bottom box, and a side plate is arranged on the upper surfaceof the bottom box. Bulges matched with each other are arranged at the bottom of the side plate and the top of the bottom box, threaded openings are formed at the bottom of the side plate and the top of the bottom box, and a lifting plate is arranged at the inner side of the side plate above the bottom box. A screw rod is arranged on the side face of the side plate, the top of the screw rod is fixedly connected with a first bearing at the top of the side plate, and the bottom of the screw rod is fixedly connected with a second bearing at the top of the bottom box. The top of the screw rod is movably connected with the first bearing, and the bottom of the screw rod is movably connected with the second bearing. A dust collector on the side face of a box body is matched with an air blower at the top of the lifting plate to work and then is connected through an air inlet pipe, so that in the chip packaging process, the head of the dust collector is aligned to the chip to suck out dust, andthe dust is discharged through the air blower, and accordingly the dust-free effect of a chip packaging environment is achieved, and the chip yield is increased.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to chip packaging equipment. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role in CPU and other LSI integrated circuits. Since Intel Corporation designed and manufactured a 4-bit microprocessor chip in 1971, in more than 20 years, CPU has developed from Intel 4004, 80286, 80386, 80486 to Pentium , PⅡ, PⅢ, P4, from 4-bit, 8-bit, 16-bit, 32-bit to 64-bit; the main frequency has developed from MHz to today’s GHz; ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67017H01L21/67121H01L21/68757H01L21/68785
Inventor 王淑琴
Owner 湖州靖源信息技术有限公司
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