Integrated circuit board manufacturing method

Abstract

The invention belongs to the technical field of integrated circuit boards, and particularly relates to an integrated circuit board manufacturing method. An integrated circuit board manufacturing and processing device is adopted to perform glue dispensing on the surface of a circuit board. The method specifically comprises the following steps: step 1, placing integrated circuit boards: stacking integrated circuit boards on the upper surface of a bearing plate; step 2, dispensing glue onto the integrated circuit boards: aligning a glue outlet with a position to be dispensed on the integrated circuit boards by adjusting the positions of an electric sliding block and a mounting block, and rotating a motor in a reciprocating manner to drive a rubber plug to move upwards so as to enable silica gel in a dispensing head to flow out of the glue outlet and drop onto the uppermost integrated circuit board; and step 3, moving out the integrated circuit board: pushing the integrated circuit board at the uppermost layer out of an accommodating cavity through a pushing mechanism. When the integrated circuit board manufacturing method provided by the invention is adopted to dispense glue on the surface of an integrated circuit board, the glue dispensing amount and the glue dispensing position can be accurately controlled.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit boards, and in particular relates to a manufacturing method of integrated circuit boards. Background technique [0002] The integrated circuit board uses semiconductor manufacturing technology to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon chip, and combines the components into a complete circuit board according to the method of multi-layer wiring or tunnel wiring. electronic circuit. The patch components on the integrated circuit board are usually pasted and fixed with silica gel. When dispensing glue on the surface of the integrated circuit board, the current method used is that the operator holds a glue gun to dispense glue on the surface of the integrated circuit board. In the actual production process, this method has the following problems: (1) Manual dispensing is difficult to accurately control the amount of glue di...

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for manufacturing an integrated circuit board, with the purpose of solving the following problems that exist when manual dispensing is performed on the surface of an integrated circuit board: (1) it is difficult to accurately control the amount of dispensing each time when dispensing manually, and it is easy The result is too much or too little, resulting in silicone overflowing the edge of the patch component or the sticking of the patch component is not firm; (2) It is difficult to accurately control the dispensing position by manual dispensing. After the patch component is pasted on the circuit board, the silicone The thickness of the layer is uneven, so that the chip components cannot be kept parallel to the surface of the integrated circuit board, which reduces the sticking effect of the chip components

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