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Hard board air guide hole plugging technology

A technology of air plugs and hard boards, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of small resin bubbles, poor hole processing, etc., and achieve the effect of facilitating flow

Inactive Publication Date: 2020-06-26
SICHUAN RUIHONG ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Of course there are other reasons, such as poor hole processing, small air bubbles may be generated when the resin flows down the wall

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The present invention is further described below, but the protection scope of the present invention is not limited to the following description.

[0031] This scheme discloses a hard board air guide plug hole process, the steps of which are:

[0032] S1, drilling;

[0033] S11. On the splint that is the same size as the PCB board, draw a mark that is consistent with the position of the PCB board to be drilled. In order to facilitate intuitive marking, the splint used is a transparent plastic plate;

[0034] S12. Clamp the PCB board with the marked splint from the upper and lower sides, and compact it to form a whole, and drill holes at the marked place. When drilling, the drill bit penetrates the lower splint, that is, the wide mouth of the hole is located at the upper and lower sides. On the splint, keep the diameter of the hole on the PCB constant; because the drill bit will vibrate at the wide mouth, it will affect the quality of the hole, and the hole will not be s...

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PUM

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Abstract

The invention relates to a hard board air guide hole plugging technology. The technology comprises the following steps: S1, performing drilling: S11, making marks consistent with a to-be-drilled position of a PCB on clamping plates consistent with the PCB in size; S12, clamping the PCB from the upper surface and the lower surface through the clamping plates with the marks, compacting the clampingplates to form a whole, and drilling holes in the marked positions; S13, detaching the clamping plate below the PCB, and reserving the clamping plate above the PCB to form a whole; S2, performing holeplugging: S21, arranging an air guide plate at the bottom of the integral plate in the step S12, and filling the holes with resin particles; S22, placing the plate with the resin particles in a high-temperature oven for high-temperature primary curing; S23, after each curing for 3-6 minutes, taking out the plate, placing the plate in an ultrasonic vibrator for vibration, and defoaming the plate;S3, after curing is completed, dismounting the clamping plate and the air guide plate after cooling; and S4, flattening the resin overflowing out of the holes. The technology has the beneficial effects that cavitation bubbles are not likely to be generated, and the plate quality is improved.

Description

technical field [0001] The invention relates to the technical field of PCB board preparation, in particular to a hard board air guide plug hole process. Background technique [0002] With the development of electronic products in the direction of thin, small, and micro, the requirements for PCB are also higher, especially the requirements for plug holes, for example, there must be no difficulty in mounting components. However, the general plugging method is prone to defects in the hole, such as the concave shape. After the lamination process, the thickness of the inner layer is no longer uniform, even if it is electroplated, it still cannot be covered. After multiple laminations, This defect will be magnified layer by layer. [0003] Therefore, more and more manufacturers now use resin plug holes, and it has developed from more than 60 companies in the world to universal use. However, when the resin flows from top to bottom, it is easy to produce cavitation and burst holes...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0094H05K2203/1178
Inventor 陈绍智罗献军张勇王韦罗家兵郑海军罗伟杰
Owner SICHUAN RUIHONG ELECTRONIC TECH CO LTD