Semiconductor chip with first protective film, method for manufacturing semiconductor chip with first protective film, and method for evaluating laminate of semiconductor chip and first protective film

A semiconductor and protective film technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as semiconductor devices not functioning normally, semiconductor packaging reliability decline, etc.

Pending Publication Date: 2020-06-26
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the reliability of the semiconductor package is reduced, and the semiconductor device cannot function normally.

Method used

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  • Semiconductor chip with first protective film, method for manufacturing semiconductor chip with first protective film, and method for evaluating laminate of semiconductor chip and first protective film
  • Semiconductor chip with first protective film, method for manufacturing semiconductor chip with first protective film, and method for evaluating laminate of semiconductor chip and first protective film
  • Semiconductor chip with first protective film, method for manufacturing semiconductor chip with first protective film, and method for evaluating laminate of semiconductor chip and first protective film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0262] ◎Method for producing thermosetting resin film-forming composition

[0263] The thermosetting resin film forming composition, such as the resin layer forming composition (III), can be obtained by blending each component which comprises this composition.

[0264] The order of addition of the respective components is not particularly limited, and two or more components may be added simultaneously.

[0265] When a solvent is used, it may be used by mixing the solvent with any blended ingredients other than the solvent and diluting the blended ingredients beforehand, or by mixing the solvent with any blended ingredients other than the solvent. These blending components are mixed and used.

[0266] The method of mixing the components at the time of blending is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer or a stirring blade; a method of mixing by using a mixer; A method of mixing by a...

Embodiment 1

[0437] "Manufacture of the first protective film forming sheet"

[0438]

[0439] Polymer component (A)-1 (9.9 parts by mass), epoxy resin (B1)-1 (37.8 parts by mass), epoxy resin (B1)-2 (25.0 parts by mass), thermosetting agent (B2)- 1 (18.1 parts by mass), curing accelerator (C)-1 (0.2 parts by mass) and filler (D)-1 (9.0 parts by mass) were dissolved or dispersed in methyl ethyl ketone, and stirred at 23°C , as a composition for forming a thermosetting resin film, a resin layer-forming composition (III) having a solid content concentration of 55% by mass was obtained. In addition, the compounding quantity of each component shown here is solid content quantity.

[0440]

[0441] Using a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) obtained by peeling one side of a polyethylene terephthalate film by silicone treatment, the peeling The thermosetting resin film-forming composition obtained above was coated on the treated surface, and h...

Embodiment 2

[0473] By the same method as in Example 1, a first sheet for forming a protective film was produced.

[0474] Then, a semiconductor chip was manufactured by the same method as in Example 1, except that the time for irradiating the bump upper portion of the semiconductor wafer in the laminated structure (3) with plasma was set to 3 minutes instead of 5 minutes. A protective film laminate (semiconductor chip with first protective film), bumps were evaluated. The results are shown in Table 1.

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Abstract

A semiconductor chip with a first protective film according to the present embodiment is provided with: a semiconductor chip; and a first protective film formed on a bump-containing surface of the semiconductor chip, wherein when analyzing a parietal portion of a bump by X-ray photoelectron spectroscopy, the ratio of the concentration of tin to the total concentration of carbon, oxygen, silicon, and tin is 5% or more.

Description

technical field [0001] The present invention relates to a semiconductor chip with a first protective film, a method for manufacturing a semiconductor chip with a first protective film, and a method for evaluating a semiconductor chip-first protective film laminate. [0002] This application claims priority based on Japanese Patent Application No. 2017-221987 filed in Japan on November 17, 2017, the contents of which are incorporated herein. Background technique [0003] Conventionally, when mounting a multi-pin LSI package for an MPU or a gate array on a printed wiring board, a flip-chip mounting method is used, in which a semiconductor chip is used as a semiconductor chip with a common chip formed on its connection pad portion. solder, high-temperature solder, gold, etc. to form a semiconductor chip with protruding electrodes (hereinafter referred to as "bumps" in this specification), and through the so-called flip-chip method, these bumps are connected to the chip mounting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60G01N23/2273H01L21/304
CPCG01N23/2273H01L21/304H01L2224/11H01L21/78H01L21/6836H01L2221/6834H01L2221/68327
Inventor 佐藤明德四宫圭亮坂东沙也香
Owner LINTEC CORP
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