Adhesive film, laminate and cured product thereof, semiconductor device and method for producing same

An adhesive film and compound technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as difficult filling, and achieve the effect of improving reliability and improving yield.
CN105027273BActive Publication Date: 2019-01-22SUMITOMO BAKELITE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUMITOMO BAKELITE CO LTD
Publication Date
2019-01-22

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Abstract

An object of the present invention is to provide an adhesive film (10) having both sufficient transparency and reliability of welded portions. The present invention is an adhesive film (10) for connection between terminals, which is interposed between an electronic component (20) having a plurality of first terminals (21) on its surface and a plurality of second terminals corresponding to the above-mentioned terminals (21) (31) Between the circuit components (30), the above-mentioned first terminal and the second terminal are electrically connected, the width of the above-mentioned first terminal (21) is not less than 3 μm and not more than 100 μm, and the above-mentioned first terminal (21) has a surface covering the terminal At least a part of the metal composition with a low melting point satisfies 0.6<A / B<1.4 when the width of the first terminal (21) is A and the width of the metal composition is B, and B satisfies 2 μm or more and 170 μm Hereinafter, the distance between the metal compositions of adjacent first terminals (21) is not less than 3 μm and not more than 60 μm, and the adhesive film (10) is made of a resin containing a filler material in an amount of not less than 10% by weight and not more than 70% by weight. The composition composition has a surface roughness Ra of 0.03 μm or more and 1.0 μm or less.
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Description

technical field

[0001] The present invention relates to an adhesive film, an adhesive film integrated with a dicing sheet, an adhesive film integrated with a back grinding tape, an adhesive film integrated with a back grinding tape and a dicing sheet, and a laminate , a cured product of a laminate, a semiconductor device, and a method for manufacturing the semiconductor device.

[0002] This application claims priority based on Japanese Patent Application No. 2013-045020 for which it applied in Japan on March 7, 2013, and uses the content here. Background technique

[0003] In recent years, with the demand for higher functionality and thinner and shorter electronic equipment, the number of semiconductor devices used in these electronic equipment has also increased compared to the past, and miniaturization and multi-pins have gradually progressed. Soldering is widely used in order to obtain electrical connections between electronic components in these semiconductor devices, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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