Negative Photosensitive Resin Composition

A technology of photosensitive resin and composition, applied in the field of cured film and negative photosensitive resin composition, can solve the problems of reduced storage stability, poor pattern formation and development, etc., and achieves the effect of high sensitivity and small shrinkage
CN104641294BActive Publication Date: 2019-08-23NISSAN CHEM IND LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NISSAN CHEM IND LTD
Publication Date
2019-08-23

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Abstract

[Problem] To provide a negative photosensitive resin composition which can form a thick film even if the composition is in the form of a solution having a low viscosity, and which is free from tack before exposure, is capable of forming a high-resolution pattern by alkali development, and provides a coating film that has high transparency and undergoes small shrinkage after post-bake. [Solution] A photosensitive resin composition which contains the components (A), (B), (C), (D) and (E) described below; a cured film which is obtained using the resin composition; a interlayer insulating film for liquid crystal displays, which is formed of the cured film; and an optical filter which is formed of the cured film. Component (A): a copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) N-alkoxymethyl (meth)acrylamide and (ii) a monomer having an alkali-soluble group Component (B): a compound having two or more polymerizable groups Component (C): a photopolymerization initiator Component (D): a polymer having a hydroxy group Component (E): a solvent
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Description

technical field

[0001] The present invention relates to a negative photosensitive resin composition and a cured film obtained from the negative photosensitive resin composition. More specifically, the present invention relates to a photosensitive resin composition suitable for use as a display material, a cured film thereof, and various materials using the cured film. Background technique

[0002] It is known that an epoxy cationic polymerization-based UV curable resin containing an epoxy compound and a photoacid generator has high transparency, and that a photosensitive resin composition containing this resin can increase the sensitivity of exposure, so it can be used in thick-film photosensitive resins. In other words, the thickness of the photosensitive resin composition layer obtained by applying the photosensitive resin composition can be increased (for example, Patent Document 1). However, since the coating film is sticky after application and before exposure, the han...

Claims

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