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Inductor with high magnetic field efficiency and method thereof

A technology of inductors and metals, applied in the field of inductors, which can solve the problems of reduced magnetic flux and reduced performance of inductors 110

Active Publication Date: 2021-12-14
REALTEK SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The large gap between the two ends E1 and E2 reduces the magnetic flux that can be excited by the coil 111, resulting in a decrease in the performance of the inductor 110

Method used

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  • Inductor with high magnetic field efficiency and method thereof
  • Inductor with high magnetic field efficiency and method thereof
  • Inductor with high magnetic field efficiency and method thereof

Examples

Experimental program
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Embodiment Construction

[0035] This disclosure relates to inductors. While the specification describes several exemplary embodiments of the disclosure, which are considered to be the preferred modes of practicing the invention, it should be understood that the invention may be practiced in various ways and is not limited to the specific examples or embodiments described below. Specific ways of implementing any features of these examples. In other instances, well-known details are not shown or described in order to avoid obscuring characteristics of the disclosure.

[0036] Those skilled in the art understand terms and fundamental concepts related to microelectronics as used in this disclosure, such as "inductor", "capacitor", "magnetic flux", "resonant network", "dielectric" and "substrate". These terms and basic concepts are obvious to those skilled in the art, so they will not be described in detail here.

[0037] Figure 2A A layout of an inductor 210 according to an embodiment of the invention...

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Abstract

An inductor and method of manufacturing the same, the inductor comprising: a coil configured in an open-loop topology having a first multi-finger and a second multi-finger, wherein the first multi-finger is connected to the second multi-finger Multiple fingers arranged alternately and arranged on the first metal layer of the multilayer structure; multiple pairs of metal line segments arranged on the second metal layer of the multilayer structure, wherein each pair of the multiple pairs of metal line segments includes the first A metal segment and a second metal segment. The first metal line segment intersects the first multi-finger end in the top view, and is connected to the first multi-finger end through the first set of guide holes; the second metal line segment intersects the second multi-finger end in the top view, and passes through the second set of guide holes The via is connected to the second multi-finger.

Description

technical field [0001] The present invention relates to inductors, and more particularly to inductors integrated into resonant networks. Background technique [0002] Inductors can be built using multilayer structures laid out on a silicon substrate. figure 1 The layout of inductor 110 is shown. Box 110LG displays the legend. The top view is shown in box 110TV. A side view is shown in box 110SV. The inductor 110 comprises: a coil 111 arranged on a first metal layer labeled M1 and configured in an open-loop topology including a first terminal E1 and a second terminal E2, a coil 111 arranged on a layer labeled M2 The two metal wire segments (including the first metal wire segment 112a and the second metal wire segment 112b) on the second metal layer, the first via hole group 113 ( For example, as shown in the figure, it includes three guide holes 113a, 113b and 113c), and a second guide hole group 114 (such as shown in the figure) for connecting the second metal wire segm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F41/04
CPCH01F17/0013H01F41/041H01F2017/002H01F2017/0073H01F2017/0086H01F27/2804H01F27/40H01G4/40H01F27/2847H01F5/04H01F27/06H01F27/34H01F2027/065H01F5/003
Inventor 林嘉亮
Owner REALTEK SEMICON CORP